Electronics Forum | Wed Jan 12 13:57:28 EST 2005 | russ
Are you positive that the solder is sticking to the bottom of the fixture OR is it pushing the wave down so far that the solder is "squirting" out from underneath the pallet. This happens when deep/thick pallets are run at the same wave height as a n
Electronics Forum | Sat Nov 09 15:13:06 EST 2002 | mjabure
If I understand what you're saying, you are reaching reflow temp's on the top side while soldering bottom side components. You might want to run a glass gauge plate over the wave and make sure your contact pattern isn't too large. If your PCB is in c
Electronics Forum | Wed Jan 12 21:37:04 EST 2005 | KEN
How thick is this pallet? 6mm, 8mm, 10mm? I would look at: Make sure you're pot height is correct (lead clearance). If you are burrying the pallet in the fountain, your going to "push" a large volume away. The solder "push" should not plow over t
Electronics Forum | Tue Jan 21 13:51:19 EST 2014 | rgduval
Armando, Is the problem in the same spot on the board with every run? If so, there might be something about that particular location that is part of the cause (ie. ground or power plane connection). It sounds like you're seeing blow holes, or insu
Electronics Forum | Thu Aug 24 19:26:07 EDT 2006 | darby
Dave, Cygnal was taken over by Silabs. I based my design on the second link that you provided. Tell me folks, are you using one large pad with only the stencil having the grid, or are you actually breaking up the large pad into grids with mask around
Electronics Forum | Fri Aug 25 09:15:43 EDT 2006 | russ
We use a single large pad on board and reduce stencil aperture 50%. If you mask/reduce the thermal pad the solder will not wet out to edges and you will still see the part standoff with the open joints. the purpose of reduction is to wet the paste
Electronics Forum | Mon Dec 16 15:10:56 EST 2002 | Randy Villeneuve
We do not bake any of our boards prior to wave solder. If we did we would have one heck of a large oven. I would assume you are concerned about moisture sensitive components. In most cases your top side parts should only get to 80 degrees centigarde
Electronics Forum | Fri Aug 25 09:01:42 EDT 2006 | russ
We sire don't AJ, We use a single large aperture in center and the outer pads are just reduced our standard which is I believe about mil off of each side or 2 mils in X and Y. As far as side fillet, sometimes we get them sometimes we don't, I attri
Electronics Forum | Wed Aug 10 09:01:15 EDT 2005 | fctassembly
Hello Joseph, Sorry for the bad news but microcracking is a well known potential condition occuring with the SAC305 alloy. Microcracking is a condition being seen with many joints soldered with the SAC305 alloy. It is technically a shrinkage cavity
Electronics Forum | Mon Dec 20 08:26:17 EST 1999 | pascal MATHIEU
hello guys ; we are using some standard selective wave soldering unit used in lined ; the drawback of a such machine is 1/the speed which is quiet low (the board is coming on position through the conveyor, then the head delivering the solder moves s
