Electronics Forum: laser (Page 81 of 111)

Re: Aperture Reduction for QFP (fine pitch)

Electronics Forum | Tue Sep 21 17:24:58 EDT 1999 | John Thorup

| | | | My stencil thickness is 6 mil and we got qfp's with fine pitch. | | | | how many percent should i reduce my stencil aperture using a 6 mil stencil for 0.5 mm pitch and 0.4 mm pitch ? | | | | | | | | thanks | | | | | | | We use 6 mil lasercu

Re: Aperture Reduction for QFP (fine pitch)

Electronics Forum | Wed Sep 22 21:12:16 EDT 1999 | se

| | | | My stencil thickness is 6 mil and we got qfp's with fine pitch. | | | | how many percent should i reduce my stencil aperture using a 6 mil stencil for 0.5 mm pitch and 0.4 mm pitch ? | | | | | | | | thanks | | | | | | | We use 6 mil lasercu

Re: 20 mil qfp bridging

Electronics Forum | Fri Aug 13 13:47:52 EDT 1999 | Brian Wycoff

| | | | | Hello | | | | | | | | | | Having a problem with bridging on 20mil pitch qfp, only on the lead groups where squeegee goes over width of apertures. Using MPM sp-200 semi-auto, chem-etch stencil, 9-10mil width opening | | | | | 100 durometer

Re: 20 mil qfp bridging

Electronics Forum | Fri Aug 13 13:50:53 EDT 1999 | Brian Wycoff

| | | | | | Hello | | | | | | | | | | | | Having a problem with bridging on 20mil pitch qfp, only on the lead groups where squeegee goes over width of apertures. Using MPM sp-200 semi-auto, chem-etch stencil, 9-10mil width opening | | | | | | 100 du

Solder Paste Thickness Measuring Device

Electronics Forum | Thu Mar 18 12:32:16 EST 2004 | steve_arneson

There are many low cost paste inspection systems on the market today. It really depends upon your overall needs for process improvement. The CyberOptics LSM series of inspection devices use a single laser stripe to calculate both Height, Area and V

Re: Solder Paste Height

Electronics Forum | Sat Jan 06 21:56:54 EST 2001 | Greenman

While solder paste height is one possible process indicator, the other guys are right on the money - volume is key. One way to study overall paste volume is to measure every single pad, using a 3D laser analysis (see you next week for board 2)... OR

Re: solder balls on high temp.solder

Electronics Forum | Wed Dec 13 19:40:38 EST 2000 | Jerry Wetzel, SME, EM/SME

Your profile must be precise, your stencil aperture sizes and shapes are very important, and the size of the pads on the boards should be very close to what the part manufacturer recommends. We had some trouble with hi-temp paste, and discovered tha

Re: Release difficult from thick stencil

Electronics Forum | Wed Nov 01 12:19:42 EST 2000 | Fraser

Steve, someone somewhere is feeding you a line!! if you increase the draft angle from || to / \ on your laser cut stencil you increase the surface area of the side wall and hence increase the likelyhood of the paste sticking in the aperture. Whats m

MPA-V or IIIF Users?

Electronics Forum | Thu Mar 22 17:03:59 EST 2001 | williamh

I have been using an MPAV and MVIIF for about 3 1/2 years and have had some difficulties, mainly with the MPAV. After only 2 1/2 years of use we had to replace the laser because we were having alot of QFP's being mismounted. That was an $8,000 expe

Solder Paste Volume

Electronics Forum | Fri Apr 06 08:35:20 EDT 2001 | brownsj

You can buy plenty of paste height measuring systems today, ranging from full 3D laser systems to systems using an oblique light line which will measure the paste height only. I found that the lowest cost option was to attach a DTI to the focus contr


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