Used SMT Equipment | Pick and Place/Feeders
Product Details of 3D SPI-6500 Thick Paste Measurement Instrument Product Functions 1, friendly programming interface 2, a variety of measurement methods 3, scan spacing adjustable 4, image 3D simulation function 5, independent 3D dynamic obser
Used SMT Equipment | Pick and Place/Feeders
The parameters of the Star CP40LV patch machine Samsung CP40LV parameter Samsung CP40LV mount speed: 8000 CPH / H(IPC9850) servo system: servo motor drive X, Y axis-Z axis mobile drive system mount head: 3 mount heads, With fixed camera CP40LV Samsun
Used SMT Equipment | Pick and Place/Feeders
JUKI Chip Mounter – KE 2050M The best system for high-speed placement of small components. As part of a “modular concept”, the KE-2050 can be the base of a flexible placement system line designed specifically to meet the require
Used SMT Equipment | SMT Equipment
JUKI JX-300LED Surface Mount Machine Laser identification: 0603- length of 33.5MM square element laser head *1 (6 nozzle) Can be corresponding to the length of 1500MM substrate production JUKI to boast of laser recognition technology to achieve h
Used SMT Equipment | SMT Equipment
Laser identification: 0603- length of 33.5MM square element laser head *1 (6 nozzle) Can be corresponding to the length of 1500MM substrate production JUKI to boast of laser recognition technology to achieve high precision and high quality producti
Used SMT Equipment | Pick and Place/Feeders
Inline Conveyorised Machine Supplied fully working & Tested Three Independant placement Heads with Tool bank for auto tool changeover Fiducial Correction Camera Laser Align On the Fly Specified Speed 13000 CPH (Optimum conditions) Component
Used SMT Equipment | Pick and Place/Feeders
Phone/whatsapp：+8615915451009 skype:smtdwx wechat:15915451009 Email:smtdwx@gmail.com Chip components 27,100 CPH(0.199 SEC / chip, optimal condition) 19,300 CPH(according to IPC 9850) :: Component size Laser identification: 0603 ~ 33.5 mm s
Used SMT Equipment | Chipshooters / Chip Mounters
JUKI FX-3 Pick and Place machine Specification Substrate dimension: L- substrate-(410×360mm) L-wide substrate-(510×360mm)*1 XL substrate-(610×560mm) Component Height:6mm size Component range : laser discrimination radar system,0402(British 01005) ~
Used SMT Equipment | SPI / Solder Paste Inspection
KOH YONG/SPI KY8030 2XL MACHINE KY8030-2XL MC-110-2.5D video observation, image storage, thickness measurement, data recording, background light, laser brightness control, area (square, irregular polygon, circle)/volume/spacing (X, Y axis)/angle
Used SMT Equipment | SPI / Solder Paste Inspection
Solder paste thickness detector Measurement software: MC-110-2.5D video observation, image storage, thickness measurement, data recording, background light, laser brightness control, area (square Shape, irregular polygon, circle) / volume / spacin
