Electronics Forum: lcc and socket (Page 1 of 2)

Headers and SMT

Electronics Forum | Mon Nov 02 14:45:25 EST 2015 | stevezeva

Hi there! If they are just standard headers there's a company called Teka that makes headers and socket headers with solder preforms in them. They call it "Solder Bearing Lead Technology" You can drop them in the board and reflow them just like SMT p

Any differences between QFN's and LCC's?

Electronics Forum | Tue Jul 01 12:22:09 EDT 2008 | gpe.

Hi, I have a question fou you guys: Is there any difference between LCC's and QFN's? or, Are those just two terms to call the same part? Thanks for your help. Gpe.

Any differences between QFN's and LCC's?

Electronics Forum | Tue Jul 01 13:35:49 EDT 2008 | realchunks

QFNs have pads on the bottom. LCCs have pads on the sides that are exposed on the bottom.

Any differences between QFN's and LCC's?

Electronics Forum | Tue Jul 01 13:40:32 EDT 2008 | gencinas

Thanks Real Chunks. Gpe.

Re-Balling BGA and BGA sockets

Electronics Forum | Fri Jan 15 11:25:29 EST 1999 | E. R.

Does anyone have information pertaining to re-balling BGA components using balls that are preformed onto disolable paper waffers (mini BGA reballing kit)? The paper containing the specific BGA device/pattern would be placed onto the BGA then process

Re: Re-Balling BGA and BGA sockets

Electronics Forum | Wed Jan 20 20:01:27 EST 1999 | Tony Arteaga

Does anyone have information pertaining to re-balling BGA components using balls that are preformed onto disolable paper waffers (mini BGA reballing kit)? The paper containing the specific BGA device/pattern would be placed onto the BGA then pro

Re: Re-Balling BGA and BGA sockets

Electronics Forum | Fri Jan 15 14:49:32 EST 1999 | Dave F

Does anyone have information pertaining to re-balling BGA components using balls that are preformed onto disolable paper waffers (mini BGA reballing kit)? The paper containing the specific BGA device/pattern would be placed onto the BGA then proce

Re: Re-Balling BGA and BGA sockets

Electronics Forum | Wed Jun 30 18:36:21 EDT 1999 | Mark

Does anyone have information pertaining to re-balling BGA components using balls that are preformed onto disolable paper waffers (mini BGA reballing kit)? The paper containing the specific BGA device/pattern would be placed onto the BGA then proce

Fuji Flexa and Aegis w/ Circuitcam or Unicam w/Assembly Expert

Electronics Forum | Fri Jan 30 09:55:34 EST 2004 | Mark

I was wondering if anyone is using Fuji Flexa yet first of all. And if so what form of CAD socketing and documentation did you get? At the moment I run SMT programming (FujiCam) and Doc Control(Unidoc) so I will be seeing the whole picture. This will

IPC Class 3 Annular Ring and Fine Pitch BGA Challenges

Electronics Forum | Fri Sep 08 21:49:24 EDT 2017 | sbar5781

Hello, I have a few PCB boards i am trying to be manufactured that are miniaturized medical devices. Thus they require IPC Class 3 Specs. However as miniature devices they have limited space, including a 0.4mm pitch BGA socket, which currently has

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