Electronics Forum | Thu May 01 10:51:09 EDT 2008 | realchunks
You need a paste designed specifically for this. They are available. Most have 2% silver in them and higher temp flux so you can reflow at "no-lead" temps. The silver aids in the intermaetalic bond and the high temp flux allows you to reflow the n
Electronics Forum | Fri May 26 10:25:11 EDT 2006 | dwelch123
You also want to look at whether or not you are using lead free paste. "Typically" for leaded paste, 25% is acceptable, depending on end result, but lead free is less forgiving.Not only for the paste to migrate back to pad but also for comp. to right
Electronics Forum | Thu Jul 20 14:02:31 EDT 2000 | Deon Nungaray
Hi Bob, I know that that conductive adhesives have been considered as a lead relacement in the past, but have been ruled out due to cost and other process issues (surface tension etc..) IBM has extensive development data on the topic and had come up
Electronics Forum | Thu Jul 20 14:02:28 EDT 2000 | Deon Nungaray
Hi Bob, I know that that conductive adhesives have been considered as a lead relacement in the past, but have been ruled out due to cost and other process issues (surface tension etc..) IBM has extensive development data on the topic and had come up
Electronics Forum | Thu Mar 30 08:38:58 EST 2006 | Dan
We have this panel that is Gold Flash. Am I correct in assuming this is technically a lead-free panel then? We are running a WS paste, and the QFN28 has balls of solder instead of a fillet. My Max temp is 216, and the TAL was between 52-57 secs with
Electronics Forum | Thu Oct 07 07:58:29 EDT 2010 | scottp
The problem is there are also studies showing reduced reliability. Early thoughts were that if you got complete reflow of both solder materials then you'd be fine, but several studies have shown that there's something going on that's not well unders
Electronics Forum | Thu Sep 02 10:51:45 EDT 2004 | patrickbruneel
Hi Ken, Thank you for the reply Ken. I hope I don�t get my behind in trouble for subject change in this thread. But you hit the nail on the head in your comment with Hitachi, when they converted to lead-free they had a �5 times higher defect rate� i
Electronics Forum | Fri Nov 06 12:15:19 EST 2015 | derrikf
Also, for anyone who's taken an interest in this thread: We just received samples of Henkel/Loctite's room temperature stable(yes, you read that right), halide-free, lead-free pastes, both the GC 10 and the GC 3W (which is a water soluble/wash paste
Electronics Forum | Thu Dec 07 17:25:58 EST 2017 | davef
Help me understand your issue better ... Are you looking to: * Improve your products that are used for thermal cycling testing of products of other companies? * Change your production materials so that you pass thermal cycling testing of your produ
Electronics Forum | Wed Aug 15 13:40:55 EDT 2001 | rkevin
Just as there are a number of causes of solder balling there are also several factors which can lead to or encourage the formation of solder beads. - During the placement of the component solder paste may be squeezed out from underneath the compone
