Electronics Forum | Mon Jan 21 11:41:39 EST 2019 | SMTA-Tony
Lead free HASL coatings can be susceptible to yellowing during reflow due to oxidation of the tin in the coating. Some HASL solder suppliers use anti-oxidant additives in the solder to limit or prevent yellowing of the coating. You may want to ask
Electronics Forum | Thu Aug 20 21:52:22 EDT 2009 | davef
It's a safe bet that your solder alloys will merge and form a proper solder connection at ~230*C for 15 to 20 seconds. At process conditions with less time and temperature, it's a lot of bla-bla-bla. In order to understand the quality of the solder c
Electronics Forum | Fri Oct 27 08:07:03 EDT 2006 | JH
Yes, that is the unit I have tried (or as you say, a convincing copy). Sorry aj, some months ago on this thread you asked where I was based and the answer is Nottingham, England. I only check this site once every few months and it has been a busy
Electronics Forum | Thu May 04 17:14:11 EDT 2000 | Boca
Solder 'follows' heat, sounds like the fab is heating up faster than the component. Or the components are solderability 'chanllenged' and the paste turns liquid, and would rather spead out on the land than wet to the component termination. Are thes
Electronics Forum | Thu Oct 15 17:00:01 EDT 1998 | Dave F
| How are solder pastes manufactured right from the level of extracting lead and tin ? | | | Dunno. Ask these guys Dave F
Electronics Forum | Wed Jan 19 14:06:26 EST 2011 | ppcbs
Any distributors or do you know any distributors that can deliver a T5 Lead solder paste by 01/25 or close?
Electronics Forum | Wed Feb 14 02:08:40 EST 2018 | ameenullakhan
Hi Sweetoldbob, Thanks. We are using SMQ92J solder paste ( Sn63/Pb37 ). We are on higher side of reflow time for leaded paste. Regards, Ameen
Electronics Forum | Fri Jun 09 12:51:52 EDT 2006 | flipit
You can not solder to 30 micro inches of gold over nickel and certainly not 80 microns. You can not with tin lead solder or SAC305 anyway. The upper limit is between 6 and 10 micro inches of gold. This is what ENIG plates to. If you solder to gre
Electronics Forum | Tue Sep 22 06:07:02 EDT 1998 | jacqueline coia
need advice to point me in the correct direction for solution to the problem of unsoldered joints which look soldered under normal visual inspection, but when pull strength test is performed the leads are coming away from pad, no strong intermetallic
Electronics Forum | Thu May 30 11:37:27 EDT 2002 | Ron Costa
Hi Ray, A couple of things to look into: 1.date code of reel 2. what is the termination made up of tin/lead or tin/lead/palladium. Check with part manufacturer. 3.paste volume/aperture openings 4.PCB plating 5.solder paste formulation Good luck R
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