Electronics Forum | Mon Jan 09 13:11:07 EST 2006 | Joe
I assume you're using a no clean Pb/Sn paste, with a metal squeegee. Here are some generic procedures for good printing results for all pastes. Clean and dry the stencil well using alcohol and vigorously rubbing it with lint free towels, blow it off
Electronics Forum | Thu Apr 22 06:42:03 EDT 2004 | Chris Lampron
Adam, What is the pad finish on the flex circuit? Is this the only component that you are having problems with? (on this Flex)If this is the only problem area on the flex (assuming there is more than one component)then that would lead me towards the
Electronics Forum | Mon Sep 25 10:35:46 EDT 2000 | Wolfgang Busko
So what�s the difference between printing noclean, WS and leadfree that makes you look for a new printer ? Just wondering Wolfgang
Electronics Forum | Thu Jun 29 13:18:23 EDT 2000 | Gary
I was reading SMTs report on Lead Free solders and saw repeated references to Fillet Lifting as a failure mode. I have not found an explanation of what this is. Can anyone enlighten me? Thanks
Electronics Forum | Tue Aug 22 09:30:18 EDT 2000 | gdiepstraten
With the introduction of new lead-free alloys and higher temperatures to meet their specifications, can we expect different and/or more residues in the reflow soldering process?
Electronics Forum | Thu Jul 20 16:32:01 EDT 2000 | Bob Willis
I guess you are refering to lead free solders. If you read through the draft directive the plans are defined but not who will do the monitoring. Some companies do have the ability to do this sort of task but not all. The latest documents are availab
Electronics Forum | Wed Jun 23 13:59:35 EDT 1999 | Cunli
Dave, It could be more than the size of the article. We are looking into it. We have emailed the contributor of "Lead Free Solder ... ", who is a frequent visitor to the site. Hopefully we will hear from him and know what went wrong soon. Thanks
Electronics Forum | Fri Jun 06 07:15:28 EDT 2003 | davef
Which specific JEDEC standard are you talking about? It's very peculiar that JEDEC would publish such a standard.
Electronics Forum | Fri Jun 06 10:47:27 EDT 2003 | Marc Peo
Kevin, Agree with John's thoughts on profiling and the max temp of 240 degrees in particular. To add to it a bit we have seen the following parameters put in place at many assembly houses to protect against overcooking the components: --Time above
Electronics Forum | Mon Oct 11 17:50:51 EDT 2004 | evsint
Hi Please visit my website for up to date news on the EVS Solder Recovery System and news on LEAD FREE www.solderrecovery.com Thanks Simon