Electronics Forum | Thu May 30 11:12:38 EDT 2002 | robbied
If I get you right and you are looking for a micro stencil for bga rework, then you should try http://www.circuittechctr.com. They are offering a free sample of their Flextac micro stencils in a wide range of sizes. The thing with these ones is that
Electronics Forum | Wed May 10 08:41:19 EDT 2006 | russ
Yes, we added some soak, we also use a 5 zone oven. We utilize a .020" x .020" pad with center to center at .042". We only get tombstones on misplacement or bad paste release now. Registration of component is key with pbfree, the parts just don't s
Electronics Forum | Fri Sep 22 13:15:19 EDT 2006 | jaimebc
We are currently experiencing some MCSB's on 0603 components. I am looking into experimenting with the stencil thickness from 6 mil to 5 mil and also using Radiused inverted homeplate ( 20%60%20)to eliminate or reduced this problem. We are using lea
Electronics Forum | Mon Oct 19 13:32:06 EDT 1998 | Mark Schwarz
| How are solder pastes manufactured right from the level of extracting lead and tin ? | | | The Tin Institute is good but I rarely find that the raw metals industries guys know about pastes. Making a tin-lead alloy for pastes, as for raw bars, is
Electronics Forum | Sat Feb 05 12:41:41 EST 2011 | ppcbs
Any distributors or do you know any distributors > that can deliver a T5 Lead solder paste by 01/25 > or close? Thank you to everyone who provided leads. I ended up getting a T5, 63/37 paste. I can't beleive how nice it prints. I'm printing 5 m
Electronics Forum | Thu Apr 01 11:27:17 EST 2004 | Jimmy
I have some fine pitch QFP's to rework with our smt rework system (forced air). There are no intitial concerns in removing the component (we havent actually begun the rework process) however, installing a new chip presents a problem. The QFP has
Electronics Forum | Wed Jan 31 11:20:01 EST 2001 | slthomas
Thanks, Pete. In our case I think the device is just too much of a challenge to take on as a first try at the process. The reduction in lead volume from the optimum round lead to the "crescent" shape pretty much sunk us from the get-go. Just could
Electronics Forum | Tue Mar 19 07:48:26 EST 2002 | PeteC
Have QFP at o.5mm pitch with leads too oxidized for the flux in the paste to de-oxidize(in stock for boo koo time). I saw three companies on the Internet that can "tin" (solder coat) the leads. Does anybody have any experience with having this done t
Electronics Forum | Wed Jan 26 15:55:31 EST 2005 | davef
There is: * NO information to indicate leadfree solder is at all reliable regardless of class of operation. * NO material model for leadfree solder, whereas the model for lead solder was developed over many years back during a time when companies be
Electronics Forum | Wed Apr 22 10:08:52 EDT 2015 | emeto
I assume you are running Lead paste and that is why your parts are moving during reflow. Most probably these caps have leads that are bended in random directions(look at some parts from the bottom and observe how symmetrical the leads are). In additi