Electronics Forum | Tue Apr 17 13:33:00 EDT 2001 | Kris W
Howdy all! Nothin' up my sleeve!!! While attempting to reflow an RF antennae on std FR4, HASL coated, using no clean paste, in a Research Thermaflo 10, the part sometimes slides on one of the pads (as much as 0.125"). There is a slight amount of w
Electronics Forum | Wed May 05 14:24:24 EDT 1999 | Mark Lessig
Hello Kevin, I work for a leading manufacturer of paste and adhesives and have alot of experience with printing smt adhesives. We also have publications that can lead you to better understand the process. Printing of adhesives are as easy as printing
Electronics Forum | Thu May 06 09:17:30 EDT 1999 | Sokkhon Ou
| Hello Kevin, I work for a leading manufacturer of paste and adhesives and have alot of experience with printing smt adhesives. We also have publications that can lead you to better understand the process. | Printing of adhesives are as easy as prin
Electronics Forum | Fri May 07 12:58:31 EDT 1999 | John Staley
| Kevin, I also work for a major adhesive manufacturer and would be pleased to send you several technical papers and some basic equipment settings for printing adhesives. If you will leave you name and mailing address on my voice mail (800)323-6106
Electronics Forum | Sun Oct 10 00:40:42 EDT 1999 | John
| I'm searching for a source for surface mount socket savers that accept a hand test socket (Yamaichi, Nepenthe etc...). Barring availibity of an SMT socket saver does anyone know a good technique for soldering socket savers into a .250" thick, 20+ l
Electronics Forum | Sat Aug 21 12:13:17 EDT 1999 | Brian
| I am being asked, by my vendor and Purchasing people about converting from Tin/lead pads on P.C.B's to Electroless Tin Plating. | Can any one tell me what I have to change in my SMT | process (paste, reflow, etc) If any? | I ran one P.C.Boar
Electronics Forum | Sun May 16 03:38:49 EDT 1999 | Zambri
I'm running memory module product- SMT double reflow ( 12 modules per panel). I'm using the epoxy base solder paste in order to reduce the flux spattering problem onto the gold finger which could lead to the intermittent contact problem. I don't fa
Electronics Forum | Wed May 19 11:07:25 EDT 1999 | Glenn Robertson
| I'm running memory module product- SMT double reflow ( 12 modules per panel). I'm using the epoxy base solder paste in order to reduce the flux spattering problem onto the gold finger which could lead to the intermittent contact problem. | | I do
Electronics Forum | Mon Jun 12 07:42:56 EDT 2006 | brian.perry@suntroncorp.com
We are placing a gold plated device (LCC) to a NiAu PCB using a SnPb No-clean solder. We're noticing quite a bit of difficulty with reliable joints (intermittent connectivity) and if we have to rework a particular device, adjacent devices of this sa
Electronics Forum | Tue Jul 03 10:20:15 EDT 2018 | yannis
Our firm is SMT factory exclude design, components are selected by customers. We are going on a project by studying the solderability life of warranty at least 3 year for customers requirement. The theory is if the workmanship is good enough, then th
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