Electronics Forum | Wed May 09 11:25:29 EDT 2001 | medernach
What type of preheaters do you have on you're wave? I have to agree with Dave. Your leads are not cold, they are hotter than the annular ring on the PCB. This would cause the solder to go to the lead only rather than the component and land pad / a
Electronics Forum | Tue Aug 17 14:08:50 EDT 1999 | Glenn Robertson
| We have a design on which there is an ASIC that will not be produced anymore in the future. As we want to make this design over the next 10 years we are evaluating the possibility to buy the necessary ASICs for the next 10 years. This will give us
Electronics Forum | Mon Oct 19 13:32:06 EDT 1998 | Mark Schwarz
| How are solder pastes manufactured right from the level of extracting lead and tin ? | | | The Tin Institute is good but I rarely find that the raw metals industries guys know about pastes. Making a tin-lead alloy for pastes, as for raw bars, is
Electronics Forum | Thu Oct 01 13:31:09 EDT 1998 | FRANK
Assuming that you do not have a solderability problem with the board or part it sounds like you are not pumping the solder up high enough to contact the board plus push into the board by about 1.8mm. Are you using a chip wave in front of the normal
Electronics Forum | Mon Apr 14 09:39:49 EDT 2003 | davef
Consider: * Sn has a higher melting point than Pb. So the liquidous temperature of this new, non-Sn63 is going to be higher than 183*C. What was the thermal recipe measured on this solder connection? * Next thing we'd do is take problem devices and
Electronics Forum | Mon Aug 11 17:48:39 EDT 2003 | Brian W.
Assuming you are working to IPC standards, are you working to Class2 or Class 3? Class 2 has an exception to the 75% barrel fill (para 6.3.1, page 6-7). "As an exception to fill requirements of Table 6-2 on PTHs with thermal planes or conductor
Electronics Forum | Tue Apr 13 19:47:05 EDT 2004 | davef
Glue has different mechanical, thermal, and electrical properties than solder. That's why all these very nice no-lead people are furiously trying to gin-up some wacky solder alloy, rather than using glue. Among the papers in the SMTA Knowledge base
Electronics Forum | Sat Dec 17 11:45:40 EST 2005 | DAM
You know, many SMD components have copper alloy leads and then a copper (or Ni) barrier on them. On the copper (or Ni) barrier there is the finish. Usually the finish is made of Sn\Pb (tin-lead), and if I solder with a Sn\Pb solder paste it's all rig
Electronics Forum | Tue Mar 07 10:46:24 EST 2006 | muse95
I have to disagree with you, BillyD. If Craig searches the forum, he will see that the concept of a Pbfree BGA with SnPb paste has been debated many times. You say it is fine. I say it is NOT. There have been several studies done that clearly sho
Electronics Forum | Fri Aug 21 13:45:12 EDT 2009 | rossi
We are using a vapor phase oven which we have used successfully for a number of years with both leaded and unleaded solders. Recently we experienced problems with a no lead BGA that has low silver balls. The problem is that the soldered boards do no
