Electronics Forum | Mon Feb 07 13:00:06 EST 2000 | Jose RG
Hi, Last Friday, we had a new defect in our line. We found a nice and shiny solder fillet completelly attached to some component leads (in a SPLCC 84) but the solderjoints were not solder to the pads. (Hasl finishing) Any idea ?? Some contamination
Electronics Forum | Thu Dec 09 04:53:36 EST 1999 | Glen brain
Hi, It is wavesoldering defect, in single- sided copper board, using alcohol-based rosin flux. It is not a bridging between the protruding leads but a metallic (I think, it is solder) link, varies in dia./thickness, connected the basement of solde
Electronics Forum | Fri Nov 12 07:42:38 EST 1999 | Michael
We are looking for AOI for post solder inspection with short setup times for high mix assembly. Also the solder joint of J-Lead components should be inspected. We found two suppliers for such systems, Orbotech and Viscom. Can anyone help us to det
Electronics Forum | Mon Aug 16 15:39:59 EDT 1999 | Earl Moon
| We have a design on which there is an ASIC that will not be produced anymore in the future. As we want to make this design over the next 10 years we are evaluating the possibility to buy the necessary ASICs for the next 10 years. This will give us
Electronics Forum | Wed Jan 13 00:38:06 EST 1999 | Chris G.
| I need leads on equipment vendors for selective soldering systems. I have information about ERSA and Seho already. I want to contact Air Vac in particular, but I can't find thier phone number. Thanks for the help | Another for your list. Gener
Electronics Forum | Mon Sep 23 18:11:10 EDT 2002 | steveb
On an assembly reflowed in air saw the same thing: 0201's with a grainular solder joint, but 0402's and above with perfectly formed joints. Reflow profile all within acceptable tolerances. Reflowing in nitrogen solves this problem, but increases t
Electronics Forum | Fri Oct 04 12:02:53 EDT 2002 | mzaboogie
Hi Barry, One consideration that you may want to consider is the lead to hole ratio. The higher the ratio, the less solder is required to fill in the gaps and give you a fillet. Heat is a concern. You will need to ensure components will take the he
Electronics Forum | Thu Nov 07 12:35:38 EST 2002 | slthomas
Sounds like you're talking about the "heel" of the lead not being soldered, in other words, no heel fillet, which IS necessary. That problem, for us, was attributed primarily to poor layout (insufficient length of pad extension to provide room for
Electronics Forum | Mon Nov 25 18:16:40 EST 2002 | Dreamsniper
What really happens during the oxidisation process during reflow soldering? Where does the oxide goes...mix with flux etc...Is there a tin-oxide and lead oxide during the process? I believe that during wave soldering the oxides become dross...but wha
Electronics Forum | Tue Jan 21 11:03:15 EST 2003 | MA/NY DDave
Hi You already received good answers. A thing to remember is the components and the PCB. How high you go above 63/37's 183C should be limited to create a good solder joint. Too long creates problems since the components and the PCB start to be he
