Electronics Forum | Mon Sep 30 09:26:04 EDT 2002 | itempea
Russ, first step would be to get IPC-7095 on BGAs. A few notes: There can be voids in solder balls, or at the solder joints to the BGA, or at the solder joints to the PCB. Various sources or reasons can be responsible for these voids. Voids can be
Electronics Forum | Mon Nov 13 08:24:03 EST 2000 | G. English
Richard, From your description of the IC, as Wolfgang indicates it sounds like a 20mil pitch device, the aperture design really depends upon your solder paste particle size, we use a type 3 solder paste with a mesh size of �325 / +500microns. This is
Electronics Forum | Thu Mar 15 17:19:12 EST 2001 | mparker
Are the tin/lead ratios compatible betweem HASL and wave solder? Probably are, just a remote possibility. Flux application is? bubbler, sprayer? Either way, are you getting good misting, coverage on those teeny 0.5mm test points? If not, then no
Electronics Forum | Tue Jul 03 11:56:13 EDT 2001 | Russ Roberts
I am a Manufacturing Engineer working on a new bid. Please help with my question about a new process that I am unfamiliar with: The Assy that we are quoting involves a SMT PCA that is soldered to an aluminum chassis. All surfaces of the chassis that
Electronics Forum | Thu Jun 17 16:18:22 EDT 1999 | Earl Moon
| | Has anyone had problems with the Weller MT 1500 IRON/TIP solder station? | | Please advise your problem and resolution. | | | | ddj | | 6/16/99 | | | I don't like to use the needle tips (MT2 series), but the rest of the tips work fine. The MT2
Electronics Forum | Fri Jan 08 19:47:55 EST 1999 | Kwang-Seong Choi
| | HI! I am a package engineer in Korea. I have some reasons | | to desolder excessive solder at the lead of TSOP and TSOJ | | after removing them from the board. The way with solder wick is too time-consuming and depends on the operator. | | Does
Electronics Forum | Wed Sep 18 12:35:56 EDT 2002 | stepheno
Fourth - > back to design of PCB. Are there solder dams of > mask between the pads? If yes, that helps. If > not, pay close attention to stencil aperture > width and be sure that the aperture deposits less > paste by 1-2 mils per pad, centered o
Electronics Forum | Wed Nov 06 14:57:56 EST 2002 | rmorford
Nothing funny seems to happen to the connector when heated. I have no idea how to monitor the temperature of a good pad vs. a bad pad because I have no idea before reflow which ones will be good and which will be bad. I did take a board and rip the
Electronics Forum | Mon Jan 20 22:39:46 EST 2003 | davef
Hi Stevo, Most paste suppliers say something like, �above 183*C for 45 to 60 seconds.� The problem we have with statements like that is that they seem to assume that the pads, component leads, and solder paste are all near eutectic 60/40 solder. A
Electronics Forum | Tue May 13 06:57:10 EDT 2003 | davef
Your vendor site is totally correct. 2Ag is an excellent solder, but it does nothing to prevent tin and gold from reacting chemically. An earlier poster is correct gold goes into solution in liquid solder very fast, less than a second. Gold and ti
