Electronics Forum: lead free solder (Page 556 of 650)

A.O.I - Design - Brainstorm

Electronics Forum | Thu May 12 11:02:48 EDT 2005 | deyo

I've looked at a lot of AOI's in the past couple years. First and formost KEEP IT SIMPLE! Second clamp the boards down this will aid in keeping the camera feild of veiw stable, most that I've looked at this was an option not a stock feature. Also sid

Conductive contamination and the elusive solution

Electronics Forum | Fri Jul 13 11:33:54 EDT 2007 | realchunks

Just starting and already responsible for product quality and machine adjustment? Wow, you poor bastard. Ok, I will assume this problem happens on the bottom side of the board with a thru-hole IC. The short occurs on the side that doesn't have the

BGA Reflow Profile

Electronics Forum | Tue Oct 30 06:20:58 EDT 2007 | aj

Hi All, I would appreciate some advise with regard to Leadfree settings for a 5 zone reflow oven. I have a 35mm square BGA 672 pin on board. I am struggling to get the Delta T down to 2 degrees C . I have 5 Thermocuples drilled up from the bottom a

High complex board manufacturing

Electronics Forum | Tue Mar 03 03:02:17 EST 2009 | emmanueldavid

25% out of Lands in PCB, Insufficient/Inconsistent Alloy deposition which causes for poor Tackiness between Device Spheres & Paste deposited. Also note that Aperture Opening Designs in Your Stencil draws a huge role for these defects. 4. Placement: P

Burn from Soldering Iron or Measling ??

Electronics Forum | Thu May 14 22:45:46 EDT 2009 | davef

You're correct. It's a peculiar looking defect. With measling, we expect to see discrete white spots or crosses just below the surface of the base material. We don't see that here. We do see a similar condition at almost every PTH in the picture, a

ICT and specifying PCBA testing

Electronics Forum | Fri Mar 26 11:31:34 EDT 2010 | rway

I have been using ICT for a number of years. It is still a viable resource for catching defects in the production process. AOI doesn't catch everything, such as bridging on QFN or J-lead devices (this will depend on the type of AOI and camera syste

MYDATA My9 Theta error

Electronics Forum | Tue Nov 13 12:02:54 EST 2012 | jaimebc

I'll try swaping cards and see if the problem follows the card. So far, my guess would be the motor going bad. I did change the brushes, X wagon cables and every cable that goes to the midas unit. But that didn't fix it. The problem is that to replac

Re: Hot Air Nife

Electronics Forum | Thu Apr 29 10:02:07 EDT 1999 | Chrys Shea

| Anyone using hot air nife for wave soldering process. | Does it work? | Does it really eliminate solder bridging and does it create any other problems? | | any feed back will be much appriciated. | | Thanks | | Tony A | | Tony, The hot knif

Re: Cracking Capacitors and Solder Balls

Electronics Forum | Tue Jun 09 07:35:23 EDT 1998 | Steve Gregory

Hi there Gary, Your solder ball problem is very similar the problem I experienced, but I was using a water soluble paste at the time. It started by inspectors telling me that they were seeing cold solder on some SIMM's that we had built regularly. W

High tin content @ Wavesolder

Electronics Forum | Tue Feb 27 18:16:42 EST 2001 | davef

I have never seen excess tin [heard of it, just never seen it]. Excess lead yes, but tin no. See, tin oxidizes faster than lead. This means that dross has a higher tin content than the solder in the pot. So, with a very high dross machine, we regul


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