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Cut & Clinch machanism for CS-400E through hole component insertion machine

http://versatecsolutions.com/csi_ultra_clinch.html

& Clinch Insertion Machine  »  Ultra Clinch Technology Ultra Clinch Technology The CS-400E with Cut & Clinch mechnism is the only machine on the market that offers programmable lead length and clinch angle. It employs a cut . Ultra Clinch Cutter Lead Length The cutter assembly can be programmed to move up or down around the fixed standoff pin to achieve the ideal lead length (dimension . Contact us to see the specification for Cut & Clinch mechanism settings with pin hight and lead length.   Miniature Footprint The CS-400E's footprint is so small that it is virtually invisible to adjacent leads, even on dense boards "A"). Clinch Angle The outer cutters rotate over the inner cutters to cut the leads and produce the specified clinch angles. Each outer cutter can clinch its lead to any of ten programmable angles ” represents the angle between the component center line and the direction of lead clinching, either inward or outward. The figure below shows this angle for a one half inch part

Versatec, CS-400E Movies, Lead Length

http://versatecsolutions.com/csi_movies_cs400e_leadlength.html

Versatec, CS-400E Movies, Lead Length Home  »  Contact Systems Products  »  CS-400E Component Locator  »  CS-400E Movies CS-400E Cut and Clinch Machine, Lead Length The CS-400E Video Clips   Contact Systems

axial component De-Taping Machine-PCB magazine loader,PCB Multi Magazine Loader,pcb conformal coatin

https://www.ascen.ltd/Products/Component_lead_forming_machine/564.html

: ASCEN axial component de taping machine use for unloading tape for the taped axial component. Separation the tape of the taped axial lead component that can solve the component problem of lead length not enough Send Enquiry Download brochure Product Details Application :  ASCEN axial component de taping machine AS-830 use for unloading tape for the taped axial component. Separation the tape of the taped axial lead component that can solve the component problem of lead length . The axial lead former can add the sensor to achieve the automatic control  4. Can automatic de taping operation to solve the component problem of lead length no enough. 5. Machine size:L580*W500*H480mm, 70kg 6. Efficient: 7200 pcs/hour 7. Power Extractor Blog Solution machine News PCB loading machine Video Channel PCB conveyor transporter PCB depaneling machine PCB loader unloader Non-standard equipment Component lead former Dealer cooperation ASCEN Cooperation Pre-sale Service Customer Service Contact Us Search multi pcbs depaneling machine PCB vision measurement Axial lead former PRODUCTS Email:info@ascen.ltd

axial component lead trimmer-PCB magazine loader,PCB Multi Magazine Loader,pcb conformal coating mac

https://www.ascen.ltd/Products/Component_lead_forming_machine/561.html

: 7200 pcs/hour Specification   Note Name FK shape Remark A Body length 3.8~20mm Adjustable B Lead length 3mm(Min.) Adjustable C Centre length 2.5mm(Min axial component lead trimmer-PCB magazine loader,PCB Multi Magazine Loader,pcb conformal coating machine,PCB loader,PCB conveyor,PCB cutting machine,PCB inspection conveyor,pcb optical inspection Extractor Blog Solution machine News PCB loading machine Video Channel PCB conveyor transporter PCB depaneling machine PCB loader unloader Non-standard equipment Component lead former Dealer cooperation ASCEN Cooperation Pre-sale Service Customer Service Contact Us Search multi pcbs depaneling machine PCB vision measurement Axial lead former PRODUCTS Email:info@ascen.ltd Skype:supplier889 PCB Handling conveyor PCB conveyor PCB loader and unloader Solder paste printer PCB buffer Smart Production equipment PCB depaneling machine Axial component lead forming PCB auto optical

销售合同

http://alpha1technologies.com/wp-content/uploads/2018/07/S1825M-Compact-Solder-Machine.pdf

(optional 350mm) Solder Pot Capacity 200KG Preheating Length 800mm(2 zone, each zone 400mm) Peak Height 12mm Max, Lead Length 10mm PCB Board Transport Height 750  Intelligent fault alert system, on-line display and record all system errors  Adjustable wave height for Chip & lambda independently  Simple  Designed for easy maintenance Product parameters Model Lead-Free Dual Wave Soldering Machine S1825M Wave soldering Pot Dual Wave Conveyor Width Max250mm

Board Handling | Used SMT and Through Hole PCB Assembly Equipment

http://alpha1technologies.com/board-handling-3/

Board Handling | Used SMT and Through Hole PCB Assembly Equipment Alpha 1 Technologies About New Machines Axial Inserter Radial Lead Inserter Laser Marking Systems Odd Form Placement Reflow Ovens Wave Solder Terminal Inserter Board Handling AOI (Automated Optical Inspection) Custom Solutions Used Machines Equipment Rebuilds Surface Mount Through Hole Feeders 6241F Jumper Wire Kit 6241F Axial Lead Dispensing Modules AlphaCom Software Contact Parts Board Handling Board . We also offer customized conveyors in any length or configuration. See examples below: Custom Conveyor lengths Intermediate stops for hand assembly Right to left or Left to Right Process Flow

EMPF RB0009 - Solder Joint Volume Calculation Using a Spreadsheet (June 1993)

https://store.aciusa.org/EMPF-RB0009-Solder-Joint-Volume-Calculation-Using-a-Spreadsheet-June-1993--P107.aspx

: Lead Thickness Inside Lead Radius Length of Lead Foot Lead Width Pad Width Toe Angle Toe Elevation Above Pad Height of the Heel Solder Fillet Reviews Be the first to submit a review on this product

PCBL - PCB Library Expert

http://www.pcblibraries.com/LibraryExpert/Lite/

!, Ultiboard, Xpedition Supports 3D STEP model export directly from package dimensions - User control of Body, Lead and Polarity Color assignments, PTH Lead Length, Y      - Drafting rules for Silkscreen Legend, Assembly, Courtyard, Component and Terminal Lead Outlines, Reference Designators, Polarity Marking Automation and feature on/off buttons in & out, Mirror, Rotate Tools for PADS to CAD, Convert units, Pad Stack and Hole Size Calculator and Axial Lead Form Calculator Help includes 70 videos that describe every feature and a Check for Update

PCBL - News

http://www.pcblibraries.com/news/2017-05-11_Lite-3D.asp

       - User controls the Body, Lead and Polarity color assignment (when different than default)        - User definable lead length for all through-hole parts No purchased license or registration required Training videos for every feature (70 total

http://mirtecusa.com/images/MIRTEC_MV-3%20OMNI_Desktop_3D_AOI_Machine_REV2A.PDF

) Inspection Item Missing Component, Wrong Component, Mis-Alignment, Skewed Component, Polarity, Tombstone, Bridge, Flipped, Solder Ball, Etc Component/Lead Length, Width, Height, Co-Planarity and Position Exclusive OMNI-VISION® 3D Inspection System Eight Projection DIGITAL MULTI-FREQUENCY MOIRÉ Technology Superior Lifted Lead Detection for Gull Wing Devices FULL 3D Co-Planarity and Solder Fillet Inspection Capability Superior Defect Detection, Absolute Lowest False Call Rate TECHNOLOGICALLY

Component & BGA Magazine Side-attach Loader, Unloader Operations

http://www.gpd-global.com/co_website/loader-unloader-operations.php

. The Loader and Unloader can be adjusted quickly for magazine width, length, and height to process various products such as lead frames, BGA substrates, micro BGA strips, and singulated components in boats or fixtures . The Loader and Unloader can be adjusted quickly for magazine width, length, and height to process various products such as lead frames, BGA substrates, micro BGA strips, and singulated components in boats or fixtures Nozzles Real Time Process Control (FPC) Lead Formers Lead Formers Selection Axial Lead Former Radial Lead Former Peel Force Tester Peel Back Force Tester Applications APPLICATIONS OVERVIEW Conductive Adhesive Non-Conductive Adhesive Dam

Component & BGA Magazine Side-attach Loader, Unloader Operations

https://www.gpd-global.com/co_website/loader-unloader-operations.php

. The Loader and Unloader can be adjusted quickly for magazine width, length, and height to process various products such as lead frames, BGA substrates, micro BGA strips, and singulated components in boats or fixtures . The Loader and Unloader can be adjusted quickly for magazine width, length, and height to process various products such as lead frames, BGA substrates, micro BGA strips, and singulated components in boats or fixtures Nozzles Real Time Process Control (FPC) Lead Formers Lead Formers Selection Axial Lead Former Radial Lead Former Peel Force Tester Peel Back Force Tester Applications APPLICATIONS OVERVIEW Conductive Adhesive Non-Conductive Adhesive Dam

Instructor Soldering Series - Blackfox.com

https://www.blackfox.com/blackfox-courses/instructor/soldering-series/

% or better WHAT THE “LEARNER” RECEIVES: A student soldering manual with step-by-step instructions Lead free PCB with lead free components for practical exam Prerequisite: None Class Length: 2 days Price: Call for quote Español Blackfox Courses Instructor Soldering Series Component Series Mechanical Assembly Series Operator “A La Carte” Soldering Series Customizable Soldering Comprehensive Soldering MIL-STD Series Printed Circuit Board Repair ESD System Integration Mechanical Assembly Series Soldering 101 Customized Soldering Lead % or better WHAT THE “LEARNER” RECEIVES: 80-90% Hands-on application Student manual Blackfox Certification Prerequisite: None Class Length: 3 days Price: Call for quote* Certification Length : None Class Length: 2 days Price: Call for quote* Certification Length: 12 months * To schedule this training or for hosting in your area please contact Blackfox : 2.0 Surface Mount Soldering Class Length: 4 hours Price: Call for quote* Certification Length: 12 months * To schedule this training or for hosting in your area please contact Blackfox

5 Soldering Courses A la Carte Soldering Series-Blackfox

https://www.blackfox.com/blackfox-courses/operator/a-la-carte-soldering-series/

% or better WHAT THE “LEARNER” RECEIVES: A student soldering manual with step-by-step instructions Lead free PCB with lead free components for practical exam Prerequisite: None Class Length: 2 days Price: Call for quote Español Blackfox Courses Instructor Soldering Series Component Series Mechanical Assembly Series Operator “A La Carte” Soldering Series Customizable Soldering Comprehensive Soldering MIL-STD Series Printed Circuit Board Repair ESD System Integration Mechanical Assembly Series Soldering 101 Customized Soldering Lead % or better WHAT THE “LEARNER” RECEIVES: 80-90% Hands-on application Student manual Blackfox Certification Prerequisite: None Class Length: 3 days Price: Call for quote* Certification Length : None Class Length: 2 days Price: Call for quote* Certification Length: 12 months * To schedule this training or for hosting in your area please contact Blackfox : 2.0 Surface Mount Soldering Class Length: 4 hours Price: Call for quote* Certification Length: 12 months * To schedule this training or for hosting in your area please contact Blackfox

Are You Ready for Lead-free?

http://www.hellerindustries.com/00600-228.pdf

. Heated length 105" [267 cm] 9-zone Air Convection Configuration (L-R) 150" [381 cm] (2) Cool zone(2) Center draw exhaust Figure 3. This reflow oven design for lead-free processing features nine zones Are You Ready for Lead-free? The Magazine for Electronics Assembly May 2000 www.smtmag.com Designing with CBGAs • SMT 101: Adhesives/Epoxies & DispensingDesigning with CBGAs • SMT 101: Adhesives/Epoxies & Dispensing TMTM The Magazine for Electronics Assembly SMT V I S I O N A W A R D S Lead free Ready AreYou for?Lead free Ready AreYou for? V arious international market trends drive electronics manufacturers and their mate- rials and equipment suppliers to develop new assembly techniques to reduce the industry’s environmental impact. Two pri- mary forces in this drive are the movements to lead-free assembly and ISO 14000 cer- tification

heated towel rail

http://www.hellerindustries.com/search.php?zoom_query=heated+towel+rail&zoom_page=14&zoom_per_page=10&zoom_and=0&zoom_sort=2

.pdf Reflow Oven Specifications ... 0.0 cm) Conveyor Length On-Load 18" (46 cm)* 6" (15 cm)* Conveyor Length Off-Load 18" (46 cm)* 6" (15 cm)* Heated Tunnel Length 140 Instant response open coil Instant ... 4 Jul 2016   -   URL: http://www.hellerindustries.com/pdfs/1913-MarkIII-SPECS.pdf Are You Ready for Lead-free ? ... of them are exact drop-in replacements for tin/lead sol- der, all require some process adjustments. Figure 2. A reflow profile using lead-free solder usually lasts 60 to 90 seconds . The heat The primary difference between most of rises to a higher level than for lead-bearing solder and remains at that plateau for a longer the new formulations and traditional period of time . Reprinted from the May 2000 ... 15 C. While newer forced-convection ovens cally, the supports that run the length of an This narrower process window requires have been

00600-228

http://www.hellerindustries.com.cn/00600-228.pdf

. Heated length 105" [267 cm] 9-zone Air Convection Configuration (L-R) 150" [381 cm] (2) Cool zone(2) Center draw exhaust Figure 3. This reflow oven design for lead-free processing features nine zones & Dispensing TMTM The Magazine for Electronics Assembly SMT V I S I O N A W A R D S Lead free Ready AreYou for?Lead free Ready AreYou for? V arious international market trends drive electronics manufacturers and their mate- rials and equipment suppliers to develop new assembly techniques to reduce the industry’s environmental impact. Two pri- mary forces in this drive are the movements to lead-free assembly and ISO 14000 cer- tification . In some cases, the mandates take the form of legislation, such as the European Community directives that will restrict the sale of lead-bearing electronic products in Europe after January 1, 2004 . In Japan, a voluntary program of lead elimination has gathered momentum among major manufacturers, including Sony, Matsushita (Panasonic), Hitachi and Toshiba

The Greening of the Reflow Process

http://www.hellerindustries.com.cn/grnreflo.pdf

. The most widely recognized international standard for green manufacturing is ISO 14000. The guidelines for ISO compliance incorporate a broad range of measures, including lead-free assembly and flux-free emissions Association and the current draft directives of the European Union. In order to minimize environmental impacts and remove lead from the assembly process, Sony undertook a massive, multi- faceted research program . Among other activi- ties, a new, lead-free solder paste and reflow profile were developed. The primary differ- ences between the new process and a traditional process using lead-based solder are the higher melting point of the paste and the demanding thermal profile required to process it effectively . Lead-based eutectic solder melts at 183°C and achieves full liquidus at 210°C, where effective intermetallic transfer and a good solder result occurs . This leaves a gen- erous 30°C process window before the substrate and components are adversely affected, at a temperature of 240°C. Sony’s new lead-free paste, on the other hand, has a melt range of 216-200

Oven Selection and Lead-Free Solder | BTU

https://www.btu.com/document/oven-selection-lead-free-solder/

— A discussion on the oven requirements for lead free solder. This article discusses issues like oven length, thermal capacity, speed, zones, flux management, board support mechanisms, the use of nitrogen, and convection control. Type  Oven Selection and Lead-Free Solder | BTU Home Contact Us Parts Locator Search for: Menu Why BTU Products Reflow Ovens Pyramax Pyramax Vacuum Pyramax TrueFlat Pyramax ZeroTurn Dual Chamber Reflow Oven Aqua Scrub Flux Management Advanced Technologies Custom Furnaces Controlled & Events Press Releases Events In the News Careers Career Opportunities Benefits Oven Selection and Lead-Free Solder Reflow Ovens Pyramax Pyramax Vacuum Pyramax TrueFlat Pyramax ZeroTurn Dual Chamber Batteries Solar Diffusion Meridian™ Metallization SinTerra Advanced Cell Processing WINCON™ Control System Industry 4.0 Energy Pilot RecipePro Profile Guardian Upgrades Oven Selection and Lead-Free Solder Global SMT & Packaging – Oct 2004

Knowledge Center of Our Thermal Processing Expertise | BTU

https://www.btu.com/about-us/knowledge-center/

., uses a standarized cost of ownership analysis to compare in-line diffusion with batch processing. Wafer Level Packaging (2.9 MB) SECAP - 2005 --- A collection of papers on wafer level packaging and flip chip bumping covering a range of topics including plating, UBM, photolithography, and lead-free processing . Effect of High-Temperature Requirements for Lead-Free Solder (381.3 KB) Circuits Assembly - July 2004 --- The transition to lead-free processing is discussed including the lead-free process impact and whether a new reflow oven is required . SMT Magazine Step 7 Soldering (61.6 KB) SMT Magazine - Aug 2004 --- Part of SMT Magazine's "step by step" series. The "Step 7" article covers soldering including a discussion on lead-free processing . Lead Free Solder Wafer Bumping – Oven Control and Solder Material Consistency Are Critical (150.9 KB) Advanced Packaging - Sept 2004 --- A discussion on the transition to lead-free processing for wafer bump reflow with a focus on process control . Oven Selection and Lead-Free Solder (634.5 KB) Global SMT & Packaging - Oct 2004 --- A discussion on the oven requirements for lead free solder

Others - QYSMT

https://www.qy-smt.com/universal/others/page/39/?s

– C-805 High Speed Solder Optical Visual Inspection System – BF18D-P40 Lead-Free Wave Soldering System – KTU-450 Lead-Free Wave Soldering System – KTU-350 Lead-Free Hot Air Reflow Oven – KTE-1200 Lead-Free Hot Air Reflow Oven – KTE-1000 Lead-Free Hot Air Reflow Ovens – KTE-800 Automatic Vacuum Loader – LV-350W-TN Automatic Unloader Automatic Loader, Model: LD-M-TN SMT conveyor,1000mm Length Fully Automatic Solder Paste Printer – A5 DEK BOARD AT LEFT OPTO LOOM

Others - QYSMT

https://www.qy-smt.com/universal/others/page/39/

– C-805 High Speed Solder Optical Visual Inspection System – BF18D-P40 Lead-Free Wave Soldering System – KTU-450 Lead-Free Wave Soldering System – KTU-350 Lead-Free Hot Air Reflow Oven – KTE-1200 Lead-Free Hot Air Reflow Oven – KTE-1000 Lead-Free Hot Air Reflow Ovens – KTE-800 Automatic Vacuum Loader – LV-350W-TN Automatic Unloader Automatic Loader, Model: LD-M-TN SMT conveyor,1000mm Length Fully Automatic Solder Paste Printer – A5 DEK BOARD AT LEFT OPTO LOOM

V-Cut 400MM PCB Depanelizer / PCB Depaneling Machine V-Groove PCB Board/Aluminum PCB

http://www.smtspare-parts.com/sale-9504978-v-cut-400mm-pcb-depanelizer-pcb-depaneling-machine-v-groove-pcb-board-aluminum-pcb.html

: Wooden Case Lead Time: With 3~5days 400MM V-Cut PCB Depanlizer/PCB Depaneling Machine For pcbs with v-cut pcb thickness: 0.2-3.2mm v-cut thickness: 0.2-2.0mm   Features 1, Controlled by microcomputer program, it can cut board accurately with no error . 4, Operation platform can be adjustable higher and lower between 0 and 50mm. 5, As per your pcb length, we have different models for you . So any length pcb is available. 6. Available board thickness: 0-3.2mm, V-groove thickness:0-2mm 7. Pre-set the cutting start and end point to well control the cutting length. 8   Model YS-805A Cutting Length 0-400mm(For longer pcb, contact me) Outer dimension L740xW550XH460mm PCb length Different models for different length of pcb cutting : Sandy Send your inquiry directly to us ( 0 / 3000) Other Products Solder Paste Inspection Table Top 3D SPI-7500 Vision CE Manual Type Resistor Lead Cutting And forming Machine Radial Capacitor Lead Cutting Machine Carrier Tape Splicing SMT Splice

BOM SQA LEAD FREE 350X60X15 DEK Squeegee 350mm With Holder And Blade

http://www.smtspare-parts.com/sale-10996444-bom-sqa-lead-free-350x60x15-dek-squeegee-350mm-with-holder-and-blade.html

BOM SQA LEAD FREE 350X60X15 DEK Squeegee 350mm With Holder And Blade Professional Supplier Of SMT Spare Part , as Feeder, Nozzle, Filter, Motor, Laser, etc Polish Home Products About Us Factory Tour Quality Control Contact Us Request A Quote Home Products Screen Printing Machine Parts BOM SQA LEAD FREE 350X60X15 DEK Squeegee 350mm With Holder And Blade All . Vicki I'm Online Chat Now BOM SQA LEAD FREE 350X60X15 DEK Squeegee 350mm With Holder And Blade Large Image :  BOM SQA LEAD FREE 350X60X15 DEK Squeegee 350mm With Holder And Blade Product Details: Place of Origin: China Brand Name: DEK Model Number: 350mm Payment & Shipping Terms : China BOM SQA LEAD FREE 350X60X15 DEK Squeegee 350mm with holder and blade   Detail Information: 1, Part Name: DEK Squeegee 2, Part Number : 350mm 3, Application: Printer Machine 4, Material: Metal 5, Origin: China     All of the DEK series   DEK scraper YL-668(12inch,Length:300mm) DEK rubber scraper(length:350mm) DEK scraper 21inch L535

Stainless Steel Brushes,Spring Hooks,Lead Cleaner, Inspection Mirror

http://www.beautech.com/misc.cfm

Stainless Steel Brushes,Spring Hooks,Lead Cleaner, Inspection Mirror   Products: New Products MilProbes Soldering Tools Orange Sticks, Probes Miscellaneous Soldering Aid Kits Download Our Catalogs About Us . A quality tool for the technician but inexpensive enough to meet the budgetary requirement of modern manufacturing. SH-133S ( 7/8" Mirror Head, 7 ¾" Overall Length . Available in Standard and Miniature sizes. NASA Style Lead Cleaner SH-66 Lead Cleaner Use this quality tool to remove oxides, scale, grease, and dirt from leads . The tinned copper braided shielding, backed by stainless steel spring, ensures a fast and easy job. The lead cleaner meets NASA specification NP-200-4 and ensures the best wetting resoldered leads

Stainless Steel Brushes, Spring Hooks, Lead Cleaner, Inspection Mirrors for Rework

https://www.beautech.com/misc.cfm

Stainless Steel Brushes, Spring Hooks, Lead Cleaner, Inspection Mirrors for Rework   Products: New Products MilProbes Soldering Tools Orange Sticks, Probes Miscellaneous Soldering Aid Kits Download Our Catalogs About Us . A quality tool for the technician but inexpensive enough to meet the budgetary requirement of modern manufacturing. SH-133S (7/8" Mirror Head, 7 ¾" Overall Length . NASA Style Lead Cleaner SH-66 Lead Cleaner Use this quality tool to remove oxides, scale, grease and dirt from leads. The tinned copper braided shielding, backed by a stainless steel spring, ensures a fast and easy job . The lead cleaner meets NASA specification NP-200-4 and ensures the best wetting for resoldered leads. Spring Hooks SH-150 Push Version Spring Hook (9 3/4

US Webstore Product Detail | okinternational.com

https://www.okinternational.com/us-web-store/english/globalnavigation/us-webstore-product-detail?productId=efc42a90-be71-4eed-9ee6-a80aa6680124

. Ground Lead Extendability: Cord should return back to at least 85% of its original length in less than 10 minutes after hanging for 24 hours, with 1KG weight on the other end

US Webstore Product Detail | okinternational.com

https://www.okinternational.com/us-web-store/english/globalnavigation/us-webstore-product-detail?productId=fdabd469-4807-4a60-93a9-0e46560d53c2

 >  SMTC Rework Cartridge, Knife SMTC Rework Cartridge, Knife   SMTC-0161 Knife 45° - Increased tinned Area Length 2.03mm (.08") 4.8mm x 16.51mm (.18"x .65") Features and Benefits . The knife cartridges are ideal for multi-lead soldering and particularly suited to soldering of J-leaded components such as PLCCs and DRAMS

Introduction to Integrated Circuits SMD Packages - PCB Assembly,PCB Manufacturing,PCB design - OURPC

https://www.ourpcb.com/ic-smd.html

) The evolution in electronics technology has lead to small size high density electronic circuits. This is due to very small size SMD package of electronic components. SMD = 0.04 inch length and 02 = 0.02 inch width (if measurement unit is inch). If the measurement unit is metric then 0402 means 0.4mm length and 0.2mm width. Some widely used SMD  equivalent of through-hole TO220 lead packages. These SMDs have built in heat sink and can be used in high current applications. SMD The above given are some of the widely used SMT (Surface mount technology) SOT packages  ICs are classified as Small Outline ICs SOICs. There are 3 types of leads in SOICs. GULL Wing  J-lead     Flat   SO Small Outline  is the original design name . it has the molded plastic case measuring approximately 156mils (3.97mm) wide has gull wing leads with 50mils (1.27mm) lead pitch (1Mil = 1 mili inch)SMD Small Outline Medium SOM measure 220mils

PCB Trace Resistance-What Is It and How To Use

https://www.ourpcb.com/pcb-trace-resistance.html

. Although copper is the most used material in the printed circuit boards, it comes with different composition and properties. The PCB trace resistance may lead to various design and implementation issues .     Where L, W and T represent the physical area of the trace i.e., height width and length. Ρ represents the resistivity of the material and α . But, power circuits on the other hand will have significant impact even for a slight variation in resistance. Power loss will eventually lead to temperature rise and reduction in conductivity . Long PCB tracks may also lead to increase in reissuance.   3. Design optimization The most effective ways to compensate the PCB trace resistance is to compensate the resistance by increasing the trace area

Robotic Hot Solder Dip Rework Service at BEST | Solder.net

https://www.solder.net/services/robotic-hot-solder-dip/

insertion length, time Cooling Cleaning Re reeling (if required) Call BEST at (847) 797-9250 to see what lead tinning alloy conversion process is right for you. Testimonials Pads and Traces PCB Bare Board ECO / ECN Flex Circuit Repair Device Rework Reballing Lead Tinning Hand Soldering Services Laser Services Part Marking and DeMarking Laser Wire Stripping Laser De Removal Site Preparation Component Placement Component Reflow Inspection Reballing StencilQuick™ Method EZReball™ Method High Volume Method Ceramic Reballing Method Reballing Process BGA Handling DRY Packaging Challenges Optional Reballing Services Underfill rework Lead free rework INSPECTION OF ELECTRONICS HOW . RoHS Compliance The hot tin solder dip process is used to remove the leaded alloy and replacing it with a RoHS compliant alloy. Alloy Conversion Lead-free, Tin-Lead and Custom Solder Alloys  Alloy Conversion Lead-free, Tin-Lead and Custom Solder Alloys The flexibility of the BEST process and our equipment allows for refinishing to a wide variety of alloys to satisfy your requirements

BGA Pad Repair Services | Ball Grid Array Rework - BEST Inc.

https://www.solder.net/services/pcb-repair/bga-pad-repair/

Pads and Traces PCB Bare Board ECO / ECN Flex Circuit Repair Device Rework Reballing Lead Tinning Hand Soldering Services Laser Services Part Marking and DeMarking Laser Wire Stripping Laser De Removal Site Preparation Component Placement Component Reflow Inspection Reballing StencilQuick™ Method EZReball™ Method High Volume Method Ceramic Reballing Method Reballing Process BGA Handling DRY Packaging Challenges Optional Reballing Services Underfill rework Lead free rework INSPECTION OF ELECTRONICS HOW . BGA Pads Damaged BGA Pads Repaired Procedure  1. Clean and inspect the repair area.   2. Remove the defective pad and a short length of the connecting circuit. 3 . Clean the area. The length of the overlapped butt solder connection should be a minimum of 2 times the circuit width. 6. The area for the new pad on the board surface should be flat with all of the roughness taken out. 7 ” can be created out of an existing circuit frame. 8. Cut out and trim the pad using an exacto knife. Cut the length to provide the maximum allowable circuit overlap for soldering. 9

Eutectic & Lead-free Alloys Reflow System -1707EXL

http://www.jmw-inc.com/Brochures/150703-Brochure.pdf

Eutectic & Lead-free Alloys Reflow System -1707EXL The 1707 EXL Reflow System The Technology Leader in Reflow Soldering The 1707 EXL supports high mix / medium volume throughput ” Cpk software provides instant process data – at no additional charge! • Compatible with both eutectic and lead-free alloys • Lowest cost of ownership • High reliability • Best overall value NEW Power Input (3 Phase) Standard 208/240 volts 208/240 volts Breaker Size 100 amps @ 208/240 v 100 amps @ 208/240 v Optional Power Inputs Available 380/400/415/480 VAC 380/400/415/480 VAC Overall Length 134" (340 cm) 134" (340 cm) Overall Width 54" (137 cm) 54" (137 cm ) Clearance Below Conveyor Pins 1.15" (2.9 cm) 1.15" (2.9 cm) Length of PCB Support Pins .187" (4.75 mm) .187" (4.75 mm) Minimum/Maximum Board Width 2" - 20" (5 - 50.8 cm) 2" - 20" (5 - 50.8 cm

http://www.soldertools.net/product_images/PCB/circuittracerepair.pdf

. Each of the traces, as well as the epoxy packs, can be purchased individually when the supply from the kit is exhausted. Lead free & RoHS compatibility BEST PCB trace repair kits provide you with the materials to make sure that you can modify and repair lead free assemblies . The finish of the BEST circuit tracks are “lead free compatible”; they are also compatible with eutectic alloy versions. The right tools for the right job Because BEST circuit trace repair kits are designed by artisans who have been repairing circuit boards for many years, the right tools have been included ) in length Quantity Description 1 Stainless Steel curved tweezer 5 Orange Stick for forming tacks around corner 3 Resin, hardener 2gm premixed 1 X-acto knife for precision cutting

PCB repair eyelets to repair PCB plated througholes .034" ID , .046" OD and .093" LUF| Soldertools.n

http://www.soldertools.net/pcb-eyelet-eylt034046093-100/

  Eyelets are made from copper and are tin electronplated unless specified. Chose the proper eyelet keeping the following in mind: LUF The length of the eyelet barrel under the flange should be 0.020-0.035”/0.630 -0.890mm greater than the thickness of PCB(this allows the for the right length after the flange is formed) ID Eyelet inside diameter should be 0.003-0.020”/0.075 -0.500mm greater than the component lead diameter for proper fit of  the eyelet through-hole component lead. FD The flange diameter should be sized so that it does not protrude out onto other pads or conductors in the vicinity OD The clearance in the PCB hole should allow the eyelet to be inserted without

Microsoft Word - Bi58_888D_TDS_b.doc

http://qualitek.com/wp-content/uploads/2017/06/Bi58_888D_TDS_a.pdf

● 86 755 28522814 ● FAX 86 755 28522787 DSP 888D (Sn42/Bi58) LEAD FREE NO CLEAN DISPENSING SOLDER PASTE Page 2 of 6 TECHNICAL DATA SHEET Sn42/Bi58, 888D, Rev . B, 03/17 Description Qualitek ® has developed a no clean dispensing paste flux designed specifically for low temperature lead free alloys, such as Sn42/Bi58. Delta ® Solder Paste 888D is available in 10cc and 30cc syringes for easy dispensing for heat-sensitive rework applications. In addition, DSP 888D lead free solder paste exhibits superior joint strength and excellent wettability ® Bi58 is designed as a low melting temperature lead-free alloy for electronics assembly operations The Qualitek Bi58 alloy conforms and exceeds the impurity requirements of IPC- J-STD-006C and all % by weight metal loading, DSP 888D Lead Free provides as much as 10-12% higher metal volume than Sn63/Sn62. This increased in volume of DSP 888D promotes better wetting and spreading of Sn42/Bi58 alloy. SN96.5/AG3.5. 888

Microsoft Word - Bi58_888D_TDS_b.doc

https://qualitek.com/Bi58_888D_TDS_a.pdf

● 86 755 28522814 ● FAX 86 755 28522787 DSP 888D (Sn42/Bi58) LEAD FREE NO CLEAN DISPENSING SOLDER PASTE Page 2 of 6 TECHNICAL DATA SHEET Sn42/Bi58, 888D, Rev . B, 03/17 Description Qualitek ® has developed a no clean dispensing paste flux designed specifically for low temperature lead free alloys, such as Sn42/Bi58. Delta ® Solder Paste 888D is available in 10cc and 30cc syringes for easy dispensing for heat-sensitive rework applications. In addition, DSP 888D lead free solder paste exhibits superior joint strength and excellent wettability ® Bi58 is designed as a low melting temperature lead-free alloy for electronics assembly operations The Qualitek Bi58 alloy conforms and exceeds the impurity requirements of IPC- J-STD-006C and all % by weight metal loading, DSP 888D Lead Free provides as much as 10-12% higher metal volume than Sn63/Sn62. This increased in volume of DSP 888D promotes better wetting and spreading of Sn42/Bi58 alloy. SN96.5/AG3.5. 888

Hot List for

http://fknsystek.com/VME%20Extender%20Cards.htm

. Ejector latches on the front end can be used as handles and to eject the board from the card cage. Traces can carry 15 A/Path. The extender card length is 28cm .     Accessories 1 . Card Guides and Heavy Duty Card Guides with ejector handles act as lead in and hold in guides for cards to be brought out from the card cage. 2

http://www.testcoach.com/wp-content/uploads/2016/04/Flying-Probe-DFT.pdf

. The leads must be free of pin-in-paste residue, and it is desirable to probe a lead that is not longer than the diameter of the pad through which it is protruding ), through hole components with long pin lengths, SMD devices where the pin size is near the land size (SMD lands should extend out from the device a minimum of 12 mils past the worst case placement of the device lead . Sliding probes can cause solder flakes and damage to the PCB. Many factors affect the angle of the solder joint such as the length, height and how much solder is applied . Preferred solder joints used as test targets should have a length to height ratio of at least 2 to 1. Also consider the amount of solder applied

Chapter 3: Printed-Wiring Boards (PWBs)

http://www.testcoach.com/wp-content/uploads/2016/04/In-Circuit_DFT.pdf

. It is important that when a through-hole lead is used as a test point, the lead protrusion must be of a consistent length and strong enough to withstand the compressive force of the test probe . Test Point Definition The term test point will be used to refer to any feature that is probed during an electrical test, i.e. test via, test pad, or through-hole lead . Especially in complex digital testing and boundary scan. Priority of Test Targets: 1. Test Via 2. Test Pad 3. Through-hole Lead (see following section ): a minimum distance of 0.250”. This holds true for both top and bottom side components. • Test Via or Pad to a Through-hole test point: clearance of 0.065”. This helps insure a 75mil or 100mil probe on your through hole lead

日本スペリア英語_CID

http://seikausa.com/sites/default/files/documents/nse-lead-free-solder-english.pdf

wetting force t3 T1T0 T2 T3 T4 T5 T6 T7 T8 (t1) (t2) (t3) (t4) SN100C Sn-3.0Ag-0.5Cu Both times are shorter for SN100C than for Sn-3.0Ag-0.5Cu. 4.59 5.13 ■ Icicle test   Icicle length of each lead-free solder 日本スペリア英語_CID Helping you comply with RoHS For Environmental Conservation 1 As well as supplying environmentally friendly lead-free solders we support your lead-free soldering operations at every stage from the first commissioning of the line through process control and inspection to diagnostic testing to help you solve problems. Providing You with Total Support for the Change to Lead-Free CONTENTS Total Support for the Change to Lead-Free P1-2 Lead-Free Solder Alloys P3 Properties of Lead-free Solders P4 SN100C for Wave ) P13 Solder Spheres for BGA & CSP P13 Flux for Lead-Free Soldering P14 Support during Commissioning Lead-free wave soldering with Sn-Cu-Ni or Sn-Ag-Cu . Impurity levels in alloys supllied by Nihon Superior The maximum allowable level of lead permitted by the RoHS Directive is 0.1wt%. Lead-Free Solder Alloys for Environmental Conservation 3 Dross generated CollectionManufacture Refining Recovery SN100C 1) SN100CL 1

ept_H1H4.eps

http://seikausa.com/sites/default/files/documents/lead-free-packaging.pdf

. Components are intentionally shifted after mounting and reflow. Due to self-alignment nature of lead-free solder, all components are positioned normally on the lands through the reflow process. Picture 3 . One of the key factors of reflow oven is preheating. The preheating of a component and PCB is basically the same in leaded and lead- free soldering . Preheating is the range from room temperature to the melting point of solder. 1) Temperature profile Wettability of solder is influenced by the properties of flux contained in solder as well as the length of time between room temperature and melting point of solder T) should be minimized within the tolerance range during solder being melted, but not necessarily during the pre-heat stage. Minimizing Delta T in the pre-heat stage can lead to a greater delta T within a solder melting temperature, possibly resulting in longer heating or stronger convection, a direct cause of flux burnout . Minimizes Delta T between parts 2) Self-alignment effect If the temperature profile is appropriate and matches the flux properties, bridging and mis-alignment will not occur due to lead-free solder's strong self-alignment characteristics

https://essemtec.com/fileadmin/user_upload/produkt/pdf/EN/Essemtec_-_Lizard_Brochure_EN_Druckboegen.pdf

lead l Low thermal stress, efficient heat transfer l Temp. metering in heating & cooling zones l Integrated microprocessor for profile control l Highly reproducible soldering conditions l Built-in overheat security switches CELL SOLUTION LINE SOLUTION MULTITALENT SOFTWARE RO-CONTROL . Transport width adjustment of the chain conveyor is motorized. productivity. combined process. lead-free process. controlled process. flexible process. secure process. ro400fc. ro400fc.-c ro300fc. Control Board counter Optional with sensor or standard with SMEMA option Gas temp ”) Conveyor Conveyor speed range 100-800 mm/min (3.9 - 31.5”/min); Slow speed 10-200 mm/min Process Heated length 1‘620 mm (63.8”) 1‘160 mm (45.7”) Machine Footprint

https://essemtec.com/fileadmin/user_upload/produkt/pdf/EN/Essemtec_-_Lizard_Brochure_EN_A4print.pdf

lead l Low thermal stress, efficient heat transfer l Temp. metering in heating & cooling zones l Integrated microprocessor for profile control l Highly reproducible soldering conditions l Built-in overheat security switches CELL SOLUTION LINE SOLUTION l Closed loop controlled conveyor drive system l Integrated microprocessor control with LCD productivity. combined process. lead-free process. controlled process. flexible process. secure process. MULTITALENT SOFTWARE RO-CONTROL ”) Conveyor Conveyor speed range 100-800 mm/min (3.9 - 31.5”/min); Slow speed 10-200 mm/min Process Heated length 1‘620 mm (63.8”) 1‘160 mm (45.7”) Machine Footprint

SMT Reflow Ovens

http://ce-exchange.com/category/reflow-oven.cfm

.  Ovens will range in length for different throughput requirements.   Since the adoption of lead-free SMT, which requires higher temperatures for reflow, the most common oven sizes are 7 zones, 10 zones, and 12 zones for the highest throughput needs . Common considerations for SMT ovens are length, cooling type (air or water), flux management, and the conveyance (edge support and/or mesh ).  Most used ovens are very capable of lead-free soldering and the latest component technolgoies.  Newer ovens designed for lead-free will often have addition cooling capacity ) Oven (1) Reflow Oven (8) Default Vendor Type Heller 1912 EXL Oven Large pcb, 12 zone reflow oven in excellent conditional and designed for lead free CEE ID: 6224 Status : 5725 Status: Available Read Details Speedline Omni 10 Reflow Oven 10 zone reflow oven with superior water cooling - plenty of cooling for lead free CEE ID: 6074 Status

Wave solder for PCB assembly

http://ce-exchange.com/category/wave-soldering.cfm

) soldering the leads and components to the board. read more... Much like reflow ovens, wave solder machines vary in length (primarily due to additional preheats . Common considerations for wave soldering is leaded or lead-free, N2 (inert) environment or air, and number and type of preheats.  Some common brands for wave solder machines include ) All Lead Free Solder Fountain (1) Rework Station (1) Selective Soldering (2) Solder Fountain (3) Wave solder (4) Default Vendor Type AIR-VAC PCBRM-12 Solder Fountain The most cost effective solution for Thru-Hole selective soldering & desoldering CEE ID: 6151 Status : Available Read Details Electrovert Electra 600/F Wave Solder Lead Free wave in excellent condition CEE ID: 6169 Status: Available Read Details Electrovert Vectra Elite Wave solder Lead Free Electrovert Wave, loaded with options CEE ID: 6172 Status : Available Read Details Pillarhouse Jade S-200 Selective Soldering Lead Free entry-level single point selective soldering system CEE ID

Microsoft Word - PR01254848.2

https://www.zestron.com/fileadmin/Filestorage/RESPONSIVE_Website/2-Products/TIs/EN/ti1-adsorber-hm1-compact-en_PR01254848_.PDF

. Technical Data Filter length mm 254 (10'') Outer diameter cartridge Ø mm 64 Inner diameter cartridge Ø mm 27 Volume g 200 Supporting bodies and supporting cores Material Polypropylene Casing Material Polyethylene Seals Material EPDM Recommended application temperature °C / °F 20 – 70 / 68 ® A 200, VIGON® A 201, VIGON® A 250, VIGON® US, VIGON® PE 180, VIGON® PE 190A, VIGON® PE 200, ATRON® AC 205 The following metal ions can be removed by the Adsorber HM1 Compact Copper, tin, lead, iron, cobalt, cadmium, zinc, nickel, mercury, antimony, bismuth Advantages of the Adsorber process

https://www.zestron.com/fileadmin/Filestorage/RESPONSIVE_Website/2-Products/TIs/EN/ti1-adsorber-hm1-compact-en.pdf

. Technical Data Filter length mm 254 (10'') Outer diameter cartridge Ø mm 64 Inner diameter cartridge Ø mm 27 Volume g 200 Supporting bodies and supporting cores Material Polypropylene Casing Material Polyethylene Seals Material EPDM Recommended application temperature °C / °F 20 – 70 / 68 ® A 200, VIGON® A 201, VIGON® A 250, VIGON® US, VIGON® PE 180, VIGON® PE 190A, VIGON® PE 200, ATRON® AC 205 The following metal ions can be removed by the Adsorber HM1 Compact Copper, tin, lead, iron, cobalt, cadmium, zinc, nickel, mercury, antimony, bismuth Advantages of the Adsorber process

Assembler- Technical_758 | Retronix Semiconductor

https://retronixsemiconductor.com/job-search/assembler-technical_758/

weighing up to 25 lbs at arm’s length Shifts are 12 hours, on a compressed work week lasting 3-4 days alternating. Days 7am-7pm Nights 7pm-7am   Why the team Related Jobs Assembler- Technical Hillsboro, Oregon See Details Manufacturing Team Lead Hillsboro, Oregon See Details View More Jobs With over 25 years of experience in high-tech industry, we

Speedprint Demonstrates the ART of Printing at APEX 2020 | Speedprint UK

https://www.speedprint-tech.com/speedprint-demonstrates-the-art-of-printing-at-apex-2020/

. For the few manufacturers who must deal with even larger circuit boards, Speedprint’s offer the SP1550, which extends board handling capability to 61-inches in length ,” explains Speedprint President Mark Brawley. “In addition, our exceptional equipment build-quality and robust engineering technology lead directly to outstanding reliability

Surface Mount International

https://www.smta.org/icsr/speaker_forms/Paper-Format-Requirements.doc

. (You may also place all large tables and graphics is an Appendix at end of the paper after your REFERENCES) The third development stage was to build the actual notebook or desktop production motherboard in a lead-free configuration and perform the full battery of board level and system level testing . Such techniques are now fairly common for lead-free assemblies [7]. Without getting into great detail, it can be said that in the course of this extensive two year effort many lead-free issues were discovered and each was resolved prior to launching of the consumer lead-free products . Since 2005 many tens of millions of lead-free products have been produced and field results show the reliability to be as good (and in many cases better ] that the immersion silver surface finish selected for lead-free PCBs had the susceptibility to creep corrode when used in high sulfur and high humidity environments (this would include server products). DISCUSSION OF CHALLENGES All of this previous experience with converting notebook and desktop products to lead-free was leveraged in taking the next step of converting the complex and challenging

Dates, deadlines and logistics | productronica

https://productronica.com/exhibitors/plan-your-stand/dates-logistics/index.html

& Logistics Stand marketing TrustedTargeting Marketing services Matchmaking Invitations for customers Lead tracking Working Hero Trade Fair Consultation Indian Market Your key to success Plan your stay Exhibitor Shop Stand building Exhibitor passes Dates & Logistics At the fair Opening hours Restaurants productronica App Stand marketing TrustedTargeting Marketing services Matchmaking Invitations for customers Lead tracking Working Hero Visitors – The new logistics control system FairLog is the new truck time-slot management of Messe München. For vehicles with an overall length of more than 8 meters, freight forwarders can book a time-slot for their deliveries and pickups at https://messe-muenchen.fairlogportal.com

Guardian Angel

https://www.clariant.com/de/Business-Units/Industrial-and-Consumer-Specialties/Personal-Care/BeautyForward/Guardian-Angel

. Rising temperatures and changes in rainfall may lead to urban outbreaks of mosquito-borne illnesses. Such threats are ever-present in the mind of the young mother who works hard to take care of her family, but who . Download This frizz-free formulation for hair is to be applied from mid-length to ends shielding hair and scalp from damaging UV rays and air pollution Discover The Other Trends Blue Gold Fresh water is earth’s true gold and the finest beauty products can help preserve it. Mehr #ConsciousBeauty Do you desire to enrich the planet with ingredients that lead to a better tomorrow

Guardian Angel

https://www.clariant.com/en/Business-Units/Industrial-and-Consumer-Specialties/Personal-Care/BeautyForward/Guardian-Angel

. Rising temperatures and changes in rainfall may lead to urban outbreaks of mosquito-borne illnesses. Such threats are ever-present in the mind of the young mother who works hard to take care of her family, but who . You can now continue downloading the file. Download This frizz-free formulation for hair is to be applied from mid-length to ends shielding hair and scalp from damaging UV rays and air pollution Discover The Other Trends Blue Gold Fresh water is earth’s true gold and the finest beauty products can help preserve it. more #ConsciousBeauty Do you desire to enrich the planet with ingredients that lead to a better tomorrow

Technical Sessions | SMTA International

http://smta.org/smtai/tech.cfm

) Harsh Environment Applications (HE) Inspection Technologies (INS) Lead-Free Soldering Technology (LF) Manufacturing Excellence (MFX) Substrates/PCB Technology (SUB) Monday Evolving Technologies Summit Harsh Environment Symposium Tuesday 11:00am - 1:00pm 2:00 - 3:30pm 4:00 - 5:30pm Wednesday 8:00 - 9:30am 10:30am - 12:00pm 2:00 - 3:30pm 4:00 - 5:30pm Thursday Lead-Free Soldering Technology Symposium Please note that speakers with a icon are recognized as Speakers of Distinction : Keith Sweatman, Nihon Superior Co., Ltd. Monday, September 28 | 11:00am - 12:30pm Long Term Aging Effects on the Reliability of Lead Free Solder Joints In Ball Grid Array Packages With Various Pitch Sizes and Ball Alignments Cong Zhao, Chaobo Shen, Zhou Hai, Jiawei Zhang, M.J. Bozack, and J. L. Evans, Ph.D ., Auburn University Factors Impacting the Reliability of Ultra-Low Silver Lead-Free Alloys Brian Toleno, Ph.D., Neil Poole, Ph.D., Mark Curie, Ph.D., Henkel Electronic Materials LLC Mechanical Shock and Drop Reliability Evaluation of the BGA Solder Joint Stack-Ups Formed by Reflow Soldering SAC Solder Ball BGAs with BiSnAg and Resin Reinforced ., MBA, IBM Corporation Co-Chair: Robert Kinyanjui, Ph.D., John Deere Electronic Solutions Monday, September 28 | 8:00am — 10:00am Reliability of Lead-Free assembled hardware continues to be a focus item for a variety of harsh environment applications including deep well drilling, automotive under the hood, and avionics

iNEMI/SMTA Automotive Electronics Workshop: Electronic Material Challenges for Vehicles of the Futur

http://smta.org/automotive-electronics-workshop/

: 4 Ps of SMT in a Lead Free World Officers' Section  Events Event Calendar Call for Participation Conferences & Symposia SMTA International Counterfeit Symposium ICSR (Soldering & Reliability) IWLPC (Wafer-Level) LED A.R.T : 4 Ps of SMT in a Lead Free World Webinars & Webtorials Publications BookStore Journal of SMT Journal Articles Peer Review Process Committee Articles Knowledge Base Find an Article Journal Articles Conference Proceedings Webinars Call . The Presentations are expected to be approximately 15-20 minutes in length. Initially a brief general abstract is requested; no formal paper is required

SAKI Corporation

https://www.sakiglobal.com/article-xray-enables-full-inspection-inline-volume-production.html

. In other words, a more global production system has to be developed to manufacture high quality products, with shorter lead-times and low cost, to address the increased diversity in electrical product specifications . However, these methods are very limited for use as inline machines due to the length of inspection time. There is a trade-off between inspection time and accuracy

26594_OK int_techon brochure

http://www.techconsystems.com/images/companies/pdf/Techcon-Catalog102015-EN-Web.pdf

7550LL1NBL-250 700 Series Syringe Barrel Dimensions CAPACITY Overall Length A Outside Diameter B inches/mm inches/mm 3 cc 2.96/75.18 0.46/11.56 5 cc 2.83/71.9 0.59/14.99 10 cc 3.58/90.9 0.72/18.29 30 cc 4.66/118.36 0.99/25.15 55 cc 6.91/175.51 1.01/25.65 5 70 to find the ones that fit your needs. Part No. Description TN00DKIT Dispensing Tip Kit TS-P Plastic Dispensing Tips Flexible tips allow access to hard to reach areas and allow you to “customize” the length. Ideal for CA applications. 11/2" length. Sold polypropylene. Standard style is Luer lock. Luer slip and taper tip styles are also available, however minimum quantity, lead time and pricing considerations apply. In Natural color only (for black and amber refer to page 4). Part No. Description F401L-1 400 and correspond to the Luer lock specification. Part Number International Gauge I.D. I.D. Length Length Hub Color (inches) (mm) (inches) (mm) TS18-1/2-1000 Pink 18 0.033 0.838 0.5 12.7 TS18-1-1000 Pink 18 0.033 0.838 1.0 25.4 TS19-1/2-1000 Brown 19 0.028 0.711 0.5 Lavender 30 0.006 0.152 0.31 7.94 TS30-1/2-1000 Lavender 30 0.006 0.152 0.5 12.7 TS-M Metal Dispensing Tips This series consists of a stainless steel cannula and aluminium hub. Sold in bulk quantity of 500. Part Number Gauge Length Length (inches) (mm) TS14

http://www.finntestelectronics.com/wp-content/uploads/2016/02/SmartFINN_Manual.pdf

device reliability. NOTE 1: All voltage values are with respect to GND lead. 11. Recommended Operating Conditions Min Nom Max Unit Supply voltage, VDD 2.7 5 5.5 V Operating free-air temperature range, TA 0 25 70 Celsius Supply current - 7.5 12(Note1) mA (11.81 +/-) 0.5050 +/- (12.83 +/-) Sensor 0.3600 (9.15) 0.2325 +/- (5.91 +/-) Probes 100 mil 0.0397 +/- (0.835 +/-) 0.040 (1.00) Inches (mm) 0.040 (1.00) Overall Length: PCB Top to Probe Bottom 1.7765 +/- (45.13 +/-) D Rev D - 012516 14 18. Technical visually by a resistor component marking change from 103 to 123. 19.5. Rev C 2.42 – August 2006 As of August 1, 2006, a lead-free version of Smart FINN ® became available. The lead-free PCB of the Right Angle Smart FINN ® (TC03SF-R) is marked with “REV C ” at the top of the sensor. The firmware code remained at revision 2.42.  PCB Marking Change The lead-free PCB of the Vertical Smart FINN ® (TC03SF-V) is marked with a letter “C” at the bottom left of the sensor 19.6. Rev B 2.42 – March 2005 As of March 17

IPC TM-650 Test Methods Manual | IPC

http://ipc.org/test-methods.aspx

) Multimedia Training and Certification IPC Designer Programs & Certification EMS Program Management Training & Certification Professional Development Professional Development Related Resources Validation Services E-mail Forums Business Resources Technical Resources IPC Lead Free/ROHS Website PCB Tools Materials Quality/Test Design Printed Electronics Lead Free Market Research Management Roadmap Artwork/Test Vehicles/Solder Kits Presentation & Webcast Archive Multimedia Training & Certification Electronics Assembly Assembly / A-610 Training Assembly / Components Assembly / Courses Assembly / ESD Control Assembly / Hand Soldering Assembly / Lead Free Assembly / Overviews 2.2.19 Measuring Hole Pattern Location - 12/87 TM 2.2.19.1 Length, Width and Perpendicularity of Laminate and Prepreg Panels - 12/94 TM List Solder Mask Adhesion Pull Test Tape List Test Board Vendors Halogen Free IPC Lead Free/ROHS Web Site DoD Web site IPC Lead Free/ROHS Web Site PCB Tools and Calculators IPC-7351 Land Pattern Calculator and Tools PCB Supplier Roadmap Tool PCQR 2

Jumper Wires Selection

http://ipc.org/4.0_Knowledge/4.1_Standards/IPC-7711B-7721B-6_1-Jumper-Wire-Selection.pdf

. If the wire is soldered to a pin, terminal or component lead, wrap the wire a minimum of 90°. 2. Solder one end of the wire. Clean if necessary. NOTE Solder joint length needs to meet acceptability requirements, see IPC-A-610D Clause . Clean the area. 3. Remove solder from the connection point if needed. Clean the area. 4. Measure approximately the length of each wire needed in] must not violate the minimum electrical clearance. NOTE The 25 mm [0.984 in] dimension refers to the length between terminations. 2. Previous versions of this guide stated that silver plated wire . Recommended wire is solid, insulated, plated copper wire, 22 to 32 AWG with a heat-resistant insulation. Wire with tin-lead plating may be restricted due to envi- ronmental laws . JUMPER WIRE PREPARATION 1. Cut the jumper wires approximately 12.7 mm [0.50 in] longer than the estimated length needed. NOTE The length and gauge of the jumper wire may be critical

C:\400E Manual\Programming\COVER.wpd

http://islandsmt.com/wp-content/uploads/2017/06/CS-400E-Programming-Manual.pdf

34 AK@ CLINCH IN/OUT/ENABLE/DISABLE 20 AM@ MESSAGE ACTIVE/ PASSIVE/OFF 13 AN@ NO OPERATION BLANK SEQUENCE LINE 37 AP@ PART NUMBER PART NUMBER 4 AS@ SEQUENCE NUMBER MOVE TO SEQUENCE LINE 8 AW@ CUT/CLINCH PARAMETERS LEAD LENGTH/CLINCH ANGLE 21 ALT AD 19 LEAD LENGTH = 1 - 10 ONE (1) = SHORTEST TEN (10) = LONGEST CLINCH ANGLE = 1 - 10 ONE (1) = LEAST CLINCH TEN (10) = MOST CLINCH BOTH LEAD LENGTH AND CLINCH ANGLE DEFAULT TO (5). CUT/CLINCH PARAMETERS ARE DETERMINED BY BOARD DENSITY, LEAD MATERIAL , LEAD HOLE DIAMETERS AND THE LOCATION OF TRACES ON YOUR BOARD. RULES OF THUMB: (1) INCREASE THE SETTINGS FOR THICK LEADS. (2) DECREASE THE LENGTH FOR POPULATED BOARDS. OUTWARD CLINCH INWARD CLINCH CUT/CLINCH C There is only one type of inner cutter; you may choose between three types of outer cutters. Machines are shipped with Standard outer cutters. TYPE OF OUTER CUTTER* SETTING LEAD LENGTH (approx.) Minimum Bend P/N 400-1036 1 .020" Minimum Bend 2 .026" Standard P/N 400-1206 3 .032" Standard 4 .038 MULTIPLE CUT/CLINCH FIRST STEP - OUTWARD CLINCH - LAST PART 8 98 MULTIPLE CUT/CLINCH AUTO STEP - OUTWARD CLINCH - LAST PART 4 00 CUT/CLINCH ENABLE 4 01 CUT/CLINCH DISABLE 1 00 CUT/CLINCH LEAD LENGTH/CLINCH ANGLE The inform ation contained in this docum ent

http://islandsmt.com/wp-content/uploads/2017/06/CS-400E-service-manual.pdf

the Cutter Height - Each Cutter has a motor that will raise and lower the Cutter to the programmed position. This allows the lead length to be customized for every component. Adjusts the Cutter Sweep - Each Cutter has a motor that rotates the Outer Cutter ... ....28-1 Adjusting the Scope Alignment . . 2B-2 The CuVClinch Unit .2C-1 Lead Sink/Funnel Assembly ....2C-2CutterRemoval ...2C-3 Fixed CutterReplacement "A". "8" are the areas that will come between .010" and .065" from the bottom of the board without making contact. "C" is the angle between the center line, of the component holes and the direction of the lead clinching . "D" demonstrates the extension of the normal footprint if the customer elects to adjust the cutters for an exaggerated lead angle ' .500' CLIIICH DIFECTTON V8. COtrPO!|ENT LEAD SPACINO I la YtrtD ttor uto:trDt ot toaio t LEAO SPACING CLINCII DIRECTION INWAFD OUTWARD too c

Microsoft Word - Formulation Considerations for Automated Dispensing of Lea–

http://www.nordson.com/en-us/divisions/asymtek/Documents/Papers/2004_03%20_automated_dispensing_lead_free_solder_paste_NordsonASYMTEK.pdf

Microsoft Word - Formulation Considerations for Automated Dispensing of Lea– 1 Formulation Considerations for Automated Dispensing of Lead Free Solder Paste Alan Lewis, Director of Application Engineering, Asymtek alewis@asymtek.com Abstract , % metal content, and alloy of metal is discussed. Many production facilities have overcome these problems, only to have them re-appear when switching to a lead free solder formulation . This paper will focus on the formulation of solder paste for robust dispensing and how that formulation must be altered when lead free alloys are used . This model is then applied to lead free formulations to give the reader an understanding of the formulation for specific alloys as well as a tool for determining this variable for any lead free alloy . Most of the techniques and best practices for dispensing solder paste apply equally to lead free pastes and pastes containing lead

Pulse Spray PSC432 Controller Operator's Card

http://www.nordson.com/en-us/divisions/asymtek/documents/Manuals/187656a.pdf

. Trigger 1 2 X Two trigger inputs are available. Each trigger operates as a LIGHT MADE or LIGHT BROKEN signal. Programming variable (lead/ zones/lag/length . Programming variable (lead/ zones/lag/length) X Use the arrow keys (4) to review the programmed variables. 12-32 Issued 9/964 Program Mode Refer to Table 4 and Figure 1 ). Proceed to Programming variables, located on the bottom programming variable display (2). Programming variable (lead/ zones/lag/length ). The output remains on as long as you press the Nordson oval. Trigger 1 2 X Not applicable. Programming variable (lead/ zones/lag/length ” using the arrow keys (4). Press the enter key (3). Trigger 1 2 X Not applicable. Programming variable (lead/ zones/lag/length) X Not applicable. 12-32Issued 9/96 7 1232002A Copy worksheet

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delta solder paste

Non-heated dispensing system