Electronics Forum: lead-free alloys (Page 41 of 43)

USING LEAD FREE PARTS WITH LEAD PASTE

Electronics Forum | Fri Dec 09 07:10:36 EST 2005 | Mity-C

Good Morning, One problem of LF BGA's in a leaded process is the temps required to propperly collapse the BGA balls. If the BGA is LF, the alloy of the balls will not reflow until the temp reaches 217-245 C. SN 63/37 reflows at 183 C. If your profil

Lead Free Dross

Electronics Forum | Thu Jan 12 11:25:06 EST 2006 | Cmiller

We tested SAC305 in our selective solder machine and found the dross production made it an unnaceptable choice of alloy. Personaly, I cant imagine dross in a joint being a good thing but if it is a very small amount and does not occur very often, y

XRF Testing....an absolute necessity??

Electronics Forum | Mon Jan 30 06:29:51 EST 2006 | slaine

we shouldnt be talking about lead free we should be talking in terms of RoHS compliant. HMP solder is exempt in the directive even though it has a hig lead content (93.5%) as no other alloy will melt at the same temperatures 298. as HMP is exempt wi

Oop's Pb BGA's in a RoHS process?

Electronics Forum | Tue Jun 20 10:15:44 EDT 2006 | samir

Again, the verdict is mixed here as well, but from the seminars, white papers, etc. the consensus seems to be that Pb BGA's are not compatible in a Pb-Free RoHS Process...but... Pb-Free SAC BGA's are compatible in a Sn-Pb process as long as your pro

Voids problem in Lead free process

Electronics Forum | Thu Oct 05 11:40:49 EDT 2006 | Mario Scalzo, SMT CPE

David, We have seeing this more and more in the recent weeks. In a nut shell, yes; we believe that the voids that you are seeing are from the trapped air in the via from printing over it. If you could remove the Kapton tape, this might help. Also

Lead free parts on a leaded assembly

Electronics Forum | Thu Oct 05 15:41:36 EDT 2006 | Mario Scalzo, SMT CPE

Good afternoon. From what it sounds like is that the solder joins are not getting hot enough or if it Au, then the increase in the Au content of the joint is increasing the melting point of the final solder joint. To some extent, this will also hap

Good Lead-Free soldering Iron???

Electronics Forum | Thu May 01 18:26:50 EDT 2008 | jmelson

I am partial to Weller for the small rework irons. I use both the WSL with WMP (current model) and some older EC1302 irons with their power supply (I forget the model, but the one with analog setting knob and digital temp readout). I actually prefe

Sn100C Plating, Mixed Alloy Scenario

Electronics Forum | Tue Dec 13 15:18:32 EST 2011 | ck_the_flip

DaveF, That's correct. This assembly is plain old tin-lead, but our buyer purchases the bare PCB with lead-free HASL plating. My main concern was the regular tin-lead not coalescing with the PCB plating and having a weak intermetallic. I'm not fr

paste Sn42/Bi58 and Lead Finish

Electronics Forum | Fri Nov 02 09:09:56 EDT 2012 | davef

Sure you can use it it with leaded HASL. Recognize that ... * Your Sn42/Bi58 will no linger be Sn42/Bi58 * Your leaded HASL will no longer be the same leaded HASL that walked in the door to your plant * Lead from HASL coatings can diffuse through the

Indium Technical Paper in Newsletter

Electronics Forum | Wed Dec 26 16:52:57 EST 2012 | davef

"Advantages of Bismuth-based Alloys for Low Temperature Pb-Free Soldering and Rework" Author: Brook Sandy, Edward Briggs and Ronald Lasky, Ph.D. Abstract: The increased function of personal electronic devices, such as mobile phones and personal mus


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