Electronics Forum | Fri Apr 29 14:16:16 EDT 2011 | ppcbs
Below is the long explanation. This defect is most commonly found with BGA components, but can arrise with all components. I see it happening more now with lead free boards that are being assembled with a no clean flux. Best short term remedy is t
Electronics Forum | Tue Mar 15 21:48:10 EST 2005 | KEN
Huh? What is it you need to check for? What container? Explain please.
Electronics Forum | Wed Feb 08 18:19:53 EST 2006 | Mike
No we didnt. All our images where visual.
Electronics Forum | Wed Jun 22 14:14:42 EDT 2005 | Steve
Tin/Lead we have had no problem in masking off areas on a pcb during wave soldering. Lead Free alloys, Nickel Silver Copper would there be any compatability issues with a Peelable latex solder mask containing Ammonia. Really hot need to know.
Electronics Forum | Fri Dec 22 05:15:25 EST 2006 | josaf
Epoxy [ bottom side ] to Epoxy [ bottom ] ---> solder paste [ top side ]
Electronics Forum | Tue Oct 10 13:30:20 EDT 2017 | charliedci
Here is a link to a reflow profile: http://www.aimsolder.com/sites/default/files/reflow_profile_supplement_-_lead-free_solder_paste.pdf Speaking specifically about solder reflow, the process window should be based on the solder paste you are using.
Electronics Forum | Mon Dec 11 15:50:01 EST 2000 | externet
Hi ! Try fresh DRY solder paste... Keep solder paste in a sealed container until the moment of use. Humidity absorbed by the soldering paste becomes vapor violently at the moment of heating it , expelling the solder in form of balls everywhere.
Electronics Forum | Thu Feb 16 12:07:19 EST 2006 | dpmilk
We have been using Coilcraft 1008CS inductors for several years. We have had problems with them turning green when we use lead-free solder paste. We have tried several solder pastes (water soluble and no-clean)from different manufacturers, but the
Electronics Forum | Thu Sep 23 11:56:30 EDT 2004 | rkevin
We are printing on an assembly using SAC305 Alloy Sn96.5 Ag 3 Cu .5 with a no clean flux and getting virtually NO spread with either a ramp to spike or straight ramp profile. We are printing to standard FR4 board with immersion Ag finish. I am trying
Electronics Forum | Fri Dec 22 10:03:54 EST 2006 | realchunks
solder paste [ top side ] Actually it's kinda the norm in most places. Subjects your active components to one less heat cycle.
