Electronics Forum | Wed Apr 29 10:05:05 EDT 2009 | wavemasterlarry
you have to lots of paste. one makes balls, one doesnt. Then why bake parts to over come bad paste? Sounds like the paste maker mixed the formula wrong on the one lot of paste. I used to work at a paste place and a lot of hand mixing is done at t
Electronics Forum | Wed Feb 09 13:24:31 EST 2011 | waveroom
I have a customer who's solder paste is drying out on their stencils. Humidity 40-45, Temp 70degrees, no air blowing on stencil, no cleaning stencils with chemicals. Handling of paste is done correctly. I'm thinking maybe the paste froze during shipm
Electronics Forum | Mon May 13 13:45:33 EDT 2019 | whitelancer64
I am having the same problem with the MPM Accela solder paste printer machine. If the fiducials are adjusted for PCB alignment, the location of the paste is then wrong, and vision inspection fails. This is a problem for both pad preview inspection
Electronics Forum | Thu Jun 22 12:50:13 EDT 2000 | JAX
Igmar, Although I agree with Chrys that square is good,( Better volumn ) his explanation is not entirely correct. Heres a little insert from automata: With square apertures, solder paste is deposited at the center of the aperture. The center release
Electronics Forum | Tue Jul 28 16:37:24 EDT 1998 | Terry Burnette
| I think that in general it's best to deposit paste in order to increase the part standoff. This helps improve the fatigue-life of the joints by providing more strain relief. But I know from experience that it's tough to deposit paste during the r
Electronics Forum | Wed Aug 23 17:06:40 EDT 2000 | Dr. Ning-Cheng Lee
For 20 mil pitch pads, the volume control is more critical in terms of bridging concern. In general, solder paste for dispensing is more prone to slumping due to low metal load and low viscosity. If the volume dispensed is on the high end, or if the
Electronics Forum | Tue Jul 20 08:30:07 EDT 1999 | Mark Quealy
I recently switched from solder paste in 500 gram jars to 500 gram tubes. I did this to try to limit the time the paste is exposed to the room environment. But we have a need to clean the stencil every 4 - 5 boards which means taking the bulk paste l
Electronics Forum | Tue Jul 20 17:24:24 EDT 1999 | Deon Nungaray
| I recently switched from solder paste in 500 gram jars to 500 gram tubes. I did this to try to limit the time the paste is exposed to the room environment. But we have a need to clean the stencil every 4 - 5 boards which means taking the bulk paste
Electronics Forum | Tue Nov 11 16:07:52 EST 2003 | johnwnz
Folks, has anyone heard fo any problems with RF cards related to solder paste selection. Currently runnign with std SnPb paste but want to move to 2% silver paste. Was asked if this could cause any issues in term's of RF capability or interferance t
Electronics Forum | Mon Aug 23 03:12:57 EDT 2010 | grahamcooper22
Possible route causes of bridging on fine pitch ICs are; too much paste (stencil aperture wrong), poor print quality (paste smudges during printing), pcb pads not flat depending on the solderable coating, paste has poor cold slump properties, too muc
