Electronics Forum | Tue Oct 19 16:06:12 EDT 1999 | Tim O'Neill
Hi Steve, Brian's right. The best paste is the paste that works best for your application requirements. From equipment to environment to customer demands to the operators noses;all these variables will determine the best product for you. Brian's su
Electronics Forum | Wed Jan 14 08:28:15 EST 1998 | Allison
Contact your solder paste manufacturer and get the reflow profile recommended for that particular paste. Then, duplicate that reflow profile on your oven. You will need to use thermocouples. You may have to tweak this profile a little. | We use no
Electronics Forum | Wed Apr 28 12:10:14 EDT 2004 | paul_bmc
Are your solder balls after reflow a perfect sphere or are they oblong, like chushed. I know a heavy bga or incorrect reflow profile could cause bridging. Also too much flux paste. Sometimes what we do is brush the flux paste onto the pcb pads inst
Electronics Forum | Mon Nov 08 15:14:46 EST 2004 | russ
In addition to type of paste, it is also dependant on the enviroment conditions. When you say open jar are you implying that the jar is left open all day and then at the end of shift it is closed back up? Jars should only bve open for about 30 secs
Electronics Forum | Tue Dec 07 05:16:12 EST 2004 | kanwal324
We are using solder paste of Alpha Metals 390DH4. As per manufacturer guidelines the viscosity of paste after 1/2 hr. conditioning and after mixing in paste mixer,it shoule be between 800-1250KCP. Our customer is asking for viscosity to be maintained
Electronics Forum | Fri Dec 16 08:11:39 EST 2005 | rlackey
Hi Dave, Sorry, blonde moment. For our prototype line we decant the paste into a cleaned out pot, that goes under the printer hood, with the lid left on, the rest stays in the fridge until it starts to run down. If we get it wrong we definitely
Electronics Forum | Mon Jan 09 05:14:56 EST 2006 | abhinavajmera
Hi all, I want to know the possible causes of poor paste release in stencil printing process if the same brand and part number of solder paste that has been used successfully is being used with a set of process parameters which worked before. Other t
Electronics Forum | Wed Mar 15 09:36:43 EST 2006 | vicknesh28
Thanks Marc. I will try the things that u have mentioned. I am guessing if the flux can find its way between the bottom foot of the lead and the paste, there has to be a gap between the solder paste and the lead when reflow takes place. As u have sai
Electronics Forum | Fri Jan 12 07:00:27 EST 2007 | GDO
Hi guys, Pin in Paste guidelines will be included in the IPC-7525A "Stencil Design Guidelines". This draft is being reviewed now and is scheduled to be released by February, (March at the latest). There are many other sources for these guidelines
Electronics Forum | Fri Jun 08 12:05:17 EDT 2007 | bbl
If you're not doing any fine pitch or BGA's, it's a "nice to have". With manual screen printing any paste height measurement tool you got would likely generate more fails than you could deal with unless you set the parameters so wide that almost any
