Electronics Forum | Sun Aug 10 03:39:21 EDT 2008 | eyalg
Thanks Pete yes we usu ROHS solder paste in our process. I agree that this termination is more suitable for adhsive bonding rather than soldering. We'll try changing the termination type as you recommended. Eyal G
Electronics Forum | Wed Aug 27 07:13:05 EDT 2008 | eyalg
I need to solder SAC/HASL PC boards in a NON ROHS process (Tin Leaded solder paste and profile + Tin leaded components) Can I do that?? Regards, Eyal
Electronics Forum | Thu Oct 09 11:57:14 EDT 2008 | hussman
Why not build with a leaded paste or solder pot? You'll have more than 3% lead after solder. Who cares about before solder - any testing will be done on the finished product.
Electronics Forum | Tue Aug 25 13:30:35 EDT 2009 | rossi
It appears that the crack is between the paste and the ball. We physically pulled off the BGA by force and almost all the balls broke at the PCB. There was a thin layer of solder left on the pad. Maybe 1% of the balls stuck to the pad. I have attac
Electronics Forum | Fri Dec 25 08:39:48 EST 2009 | davef
Compared to 63/37, solder with high tin content: * Requires higher reflow temperatures * Demands tighter process control * Results in duller, more grainy looking solder connections Tell us about the specific problem that you seek help in solving.
Electronics Forum | Fri Jan 08 02:25:42 EST 2010 | graceytiu07
Happy New Year to All: Has anyone of you encountered a solder short on QFP pin yet there's no evidence of bridging in between gaps? I am using an SnPb solder paste.
Electronics Forum | Wed Aug 18 11:12:04 EDT 2010 | davef
So with your mounting frustration in your inability to zero-in on the factors that drive your solder balling, are you thinking that maybe you need to bite the bullet and design a experimental study to help isolate the key drivers to your solder balli
Electronics Forum | Tue Oct 05 03:24:08 EDT 2010 | mskler
This breaks the soldering not the body of the part. It breaks 90 degree from the length of teh componet.Is there any diffrence if I will use the solder paste of the type 4 for the 0603 componet.
Electronics Forum | Thu Apr 05 08:21:52 EDT 2012 | rway
Yes, but no guarantee of solderability. This just puts more paste on the pads. From my experience, unsoldered QFN parts are not due to lack of solder, but reflow.
Electronics Forum | Thu Sep 03 09:29:05 EDT 2015 | milroy
Hi All, I need to know all about intrusive soldering. A site with all possible details about stencil design, paste printing for intrusive soldering and etc.. would be very helpful to me. Thanking you in advance,
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