Electronics Forum | Tue Sep 29 08:17:30 EDT 1998 | Jim Zanolli
Teka Interconnection Systems may have a connector with their Solder Flux Bearing Lead technology -- by an economical pre-deposit of solder and flux on each connector lead, the connectors can be reflowed in convection with other SMD's without adding s
Electronics Forum | Tue Aug 25 09:29:59 EDT 1998 | Richard Scarcelli
Would like to know the following information on processing micro bga's: 1) Fine mesh solder paste .vs. tacky flux --- which is best 2) Stencil thickness for solder screen 3) Aperature size for standard pitch balls 4) Which direction is the marke
Electronics Forum | Fri Sep 11 10:52:25 EDT 1998 | Javier Carrera
| Would like to know the following information on processing micro bga's: | 1) Fine mesh solder paste .vs. tacky flux --- which is best | 2) Stencil thickness for solder screen | 3) Aperature size for standard pitch balls | 4) Which direction is
Electronics Forum | Tue Jun 16 07:52:50 EDT 1998 | Jim Zanolli
| can any body help on assembling straddle mount connectors on to a board? for information on the connector - it is a berg micropak connector Teka Interconnection Systems (http://www.tekais.com)manufactures straddle mount connectors with solder and
Electronics Forum | Sun Jun 07 09:38:42 EDT 1998 | Bob Willis
If you mean solder beads at the side of chip components then download the FAQs and the process guide on solder beads which may be of interest. The documents are on my web site www.bobwillis.co.uk | We are getting solder balls after reflow of surface
Electronics Forum | Thu Feb 28 18:42:35 EST 2002 | Nightbull
Thank you for your reply. Answer: Auditor came to my company and said that we needed a solder deposition tester. The reason was that we had no real way of assuring that our solder process was repeatable. He referred to several IPC standards that mad
Electronics Forum | Fri Apr 19 08:19:26 EDT 2002 | jnunns
If the solder balls are next to your discretes, you should consider a homeplate design on you stencil apertures. THe only other time we have seen soler balls is due to the raw card. If the vias are not plugged by the solder mask, solder and air can g
Electronics Forum | Wed Jul 09 11:58:03 EDT 2003 | sam
When we try another test by using less solder paste, we found under the microscope that the solder was actually stick on the LED gold surface, but not having good wetting. By this finding, we can basically conclude that it was poor solderability caus
Electronics Forum | Tue Oct 14 09:13:14 EDT 2003 | davef
To us, time above liquidous plus 20*C is more important than the 60 sec [er what ever] above 183*C [which we think is meaningless] that the fine solder paste supplier suggest. Based on what you've told us and lacking any failure analysis, we'd gue
Electronics Forum | Tue Jul 06 10:46:12 EDT 2004 | blnorman
We have now switched to Kester EP256. During our solder paste evaluation, resistance to humidity was one of the selection criteria. We printed multiple boards, then exposed them to 85�F/65% RH. At 30 minutes, 1 hour, 2 hours, and 4 hours exposure
