Electronics Forum | Fri Dec 27 14:22:00 EST 2019 | ameenullakhan
Hi , Thanks..., Its "not wetting the pads sufficiently" We have tried with RTS , Our paste is ROL0 based chemistry. Which solder have you changed. Regards, Ameen
Electronics Forum | Fri Jan 03 02:03:58 EST 2020 | sssamw
What's your target for voiding? I cannot see it violate 25% of solder joint area. Process setting and PCB design can impact the voiding, many factors, such as PCB pad, stencil aperture and thickness, re-flow profile, solder paste, etc.
Electronics Forum | Fri Jun 12 05:56:53 EDT 2020 | sssamw
I cannot see the logic connection between HIP and RSS or RTS, or between HIP and solder paste volume because volume is ok. Did you measured the BGA solder profile?
Electronics Forum | Fri Jun 26 14:08:49 EDT 2020 | indhu
Hi, I am having a issue that SMT nut drop after reflow. The solder height all in specifications. Had tried adding flux inand the solder paste. But shows no improvement. Is the nut easily oxidize? Can anyone help me on this?
Electronics Forum | Tue Dec 07 08:01:40 EST 2021 | jineshjpr
Hi DucHoang, Thanks for your response - Understanding that OSP will have more surface resistivity which does not allows the solder to flow on the entire pads. Let me check peak & revert back sooner.
Electronics Forum | Mon Dec 27 05:01:03 EST 2021 | jineshjpr
Hi JSeewald, You are very much right that there is difference between the solder pad with respect to IC pad. Since the Manufacturer suggests the same -- design also freezed to recommended dimensions.
Electronics Forum | Fri Feb 24 13:44:49 EST 2023 | abhishek10
This is similar to what i am looking. I have some ideas like Using spare nozzles for weekly cleaning to reduce downtime Using after windup solder paste on other lines to reduce solder scrap.
Electronics Forum | Tue Aug 08 12:57:52 EDT 2023 | serge_pirog
Good afternoon. If you provide more data, I think you can find the problem. Could you provide: part of the Gerber file, namely the stencil and BGA pad and photo of solder paste on the board after print.
Electronics Forum | Fri Sep 22 12:11:31 EDT 2023 | wippsen
Hi there, if there is insufficient Volume you may optimize the design of your stencil. Its not the goal to decrease the tolerances. Take the PCB and take a look at the printing Shapes with microscope or use the zoom in 3D Function. If there is too l
Electronics Forum | Tue Dec 26 11:09:16 EST 2000 | acahill
High temp paste or not, I feel it's all up to the oven,and/or the stencil design. are there sufficient solder joints, before running the opposite side (are the apertures large enough to achieve a hardy fillet or to small, allowing enough paste to vis
