Electronics Forum: lead-free solder paste (Page 481 of 806)

Heat Dissipation Problem

Electronics Forum | Wed Sep 01 12:26:32 EDT 1999 | Jae Hinson

To aid in heat dissipation of our PCB, we would like to try having copper fill areas on the board that are hot air levelled and not covered with solder resist. Then, when the board is reflowed, solder paste would be applied and then solder. Has anyon

Profiling

Electronics Forum | Wed Jul 21 19:16:53 EDT 1999 | Dreamsniper

Which among the two profiling method is more reliable/accurate in getting the oven thermal profile? a) using a HIGH-TEMP solder wire then soldering the thermocouples onto the profile points of the board (e.g. component lead etc.) b) not soldering t

SMT Adhesive

Electronics Forum | Thu Oct 15 15:34:16 EDT 1998 | Andrew

We have a need to bond Flatpack and Quadpack components to the circuit board. The adhesive should be quick curing, repairable and have a low modulus. It does not have to be thermally conductive (but it would be a plus). The components are currently

Reflow Test Questions

Electronics Forum | Sun Jun 07 10:04:29 EDT 1998 | Bob Willis

Here is a chance to test your knowledge on reflow soldering twenty questions you should know about reflow. Have a go at the test on my Internet home page http://www.bobwillis.co.uk There will be test sections on wave soldering, PCB design, solder pa

Flat Solderable Tin as a PWB solderable surface finish

Electronics Forum | Thu Nov 22 08:30:59 EST 2001 | krs

I have heard of this but do not have direct experience. Immersion tin is susceptible to moisture absorption particularly after washing off solder paste. So it sounds like your boards are picking up the solvent off the screen. Water rinse or degrease

Soldered PCB jumpers

Electronics Forum | Tue Nov 27 01:43:29 EST 2001 | Anders

The reason why we are using soldered PCB jumpers is that it is cheaper than dip-switches, 0 ohms resistors, etc. Field updating is also easier. We are producing different variants of some of our products. It would nice if we could presolder the PCB

Comparison between Glue & solderpaste process

Electronics Forum | Thu Jun 20 10:48:56 EDT 2002 | Hussman69

When you ask for data in terms of rework, do you want reflow solder yields versus wave solder yields? Or do you want repair data from each process, or yield data that shows actual glue defects from screen printing versus solder paste screen printing

Systems for Solderability-tests

Electronics Forum | Tue Jun 25 09:31:45 EDT 2002 | Myfloh

Hi everybody, Does someone have experience in the assesment of Surface Mount devices? For the moment we have the Must System II of Multicore but it is not effective to assess the solderability of Surface mount devices. Indeed the conditions are not

Paste / Flux during rework?

Electronics Forum | Mon Aug 12 12:58:16 EDT 2002 | pjc

What I've done w/ eutectic ball BGA devices is after removing the BGA from the PCB, solder-suck the lands- get em nice a flat, apply a thin coat of gel flux to the solder lands and then a thin coat to only the bottom of the solder balls on the new BG

Solder Paste and fine pitch components

Electronics Forum | Wed Sep 18 18:48:33 EDT 2002 | davef

Fabs can produce a solder mask web between 20 pitch leads, but I've never seen a web for 16 pitch leads. Although, I would like know a supplier that can lay-down a fine web. Minimum solder mask web width is about 0.004 thou. An absolute mininum o


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