Electronics Forum | Thu Dec 08 22:47:32 EST 2005 | davef
Satisfactory solder paste should: * Be aligned with all pads * Conform to the stencil pad-aperture size * Have a smooth, flat void-free surface
Electronics Forum | Tue Dec 13 21:20:52 EST 2005 | davef
Certain solder pastes are more affected by humidity than others. Search the fine SMTnet Archives for more on controlling humidity in your plant.
Electronics Forum | Thu Dec 15 20:57:53 EST 2005 | Ooi
What u meant by change every 1.5 day ( Expose to enviroment 1.5 day) ?
Electronics Forum | Fri Dec 16 06:13:31 EST 2005 | trs
Try to get a sample of Indium and give it a try......i happen to think its the greatest stuff since sliced bread!
Electronics Forum | Mon Jan 09 16:47:45 EST 2006 | slthomas
Perhaps I read your question wrong, but I would be more inclined to look for changes in your solder paste, your screen printing process, and your reflow profiles if you're suddenly having problems with more than one component.
Electronics Forum | Thu Jan 12 20:50:09 EST 2006 | davef
Chunkie Why doesn't your company wash those little blue smirf coats for the people? Requiring employees to wash smocks is very poor practice, because the company looses control over the wash process, materials, or schedule. Do you test the smocks
Electronics Forum | Wed Jan 18 02:00:36 EST 2006 | pavel_murtishev
Good morning, This isn�t very strange. Bottom side components are prone to tombstoning more than topside ones. Try to reduce oven�s bottom heaters temperature slightly to prevent solder paste melting on bottom side. This can help. BR, Pavel
Electronics Forum | Wed Feb 01 15:36:35 EST 2006 | Darnell
Maybe at dat homie�s shop, they opted ta use Semco ridetridges instead of jars, and they didn�t gots a process put in place ta recycle da old solder paste. - aww yea foo.
Electronics Forum | Fri Feb 03 13:15:44 EST 2006 | amol_kane
the flux in the solder paste should take care of the oxides. if possible print a board and run thru reflow to check for wetting issues......there are some published papers that say that the tarnish layer is too small to create any wetting issues or o
Electronics Forum | Fri Feb 17 18:33:08 EST 2006 | mika
Paste In Hole "PIH" or Pin In Paste "PIP" are two different names of the same process. As far as I know this is fairly simple: the reason from the beginning is to avoid an extra process step/steps in the production line. That is to produce through h
