Electronics Forum | Tue Nov 08 20:50:03 EST 2005 | davef
First, general comments about voiding in wave soldered connections are: * Causes of voids in solder connection are many: moisture, flux/paste volatiles, wave process, etc. * Impact on reliability of voids in a PTH solder connection is insignificant,
Electronics Forum | Wed Dec 20 12:49:06 EST 2006 | paul_bmc
I am looking for white papers or information on what happens to 63/37 solder paste alloys when overheated. I have had some solder joint analysis done regarding missing finish on some of the joints. The analysis came back showing a low lead content
Electronics Forum | Tue Feb 03 16:42:50 EST 2009 | cuperpeter
Hello All, > > I have a problem with nonwetting Au > finish after second cycle of reflow soldering > doublesided boards. Solder nonwetted pcb pads (is > wicked to component terminations) Either these > pads or some of non component pads became
Electronics Forum | Wed Sep 20 16:15:53 EDT 2017 | davef
Some requirements to consider are: * Humidity and temperature controlled according to J-STD-001 * Electro-static discharge (ESD) control program according to ANSI/ESD-S-20.20. * Soldering technicians are trained and certified according to J-STD-0
Electronics Forum | Tue Nov 12 09:04:21 EST 2019 | mario85
Hello Guys, I'm new here. I am smt process engineer in new company located in Poland. I am responsible for whole smt line, so I have a lot of problems at the beginning :). I would like to ask about few things. The topic is solder balls. I produced s
Electronics Forum | Wed Dec 04 04:28:58 EST 2019 | oxygensmd
It seems there isn't right connection between solder and solder-legs. Maybe check that the LEDs get huminidity, have some oxidation on the legs, try different solder paste, check the reflow solder profile. On the photo I can not saw properly reflowe
Electronics Forum | Mon Mar 25 21:45:22 EDT 2024 | buckeye
I got an inquiry from one of our electronics labs with regards to their soldering processes. They use eutectic (63% Sn, 37% Pb) solder. For liquid flux they are currently using Kester 186, which is an old-school, full rosin (RMA and ROL1) flux that c
Electronics Forum | Thu Apr 13 11:38:53 EDT 2000 | Kevin Facinelli
Couple more questions: The problem we have is that on the bottom side we are using a bunch of resistor networks. These have been very difficult to solder through the wave. The products: Top Side: 4-6 BGA 2/3 QFP 500 component
Electronics Forum | Fri Nov 26 06:18:18 EST 1999 | stefano bolleri
Jeff & Ted, we have used a dispensing system too and yes, I agree, we are not too happy with the results. Not at the point that it doesn't work, though. I think our problem basicly is that we have selected an entry-level dipensing system. We are app
Electronics Forum | Thu May 20 22:42:19 EDT 1999 | Dave F
| hi everybody, | We've been doing some studies on assembly of CSPs. We assembled these packages on micrivia-in-pad patterns. These are 15/13.5/11 mil pads with 6 mil design microvia, using photo/laser/plasma tech. We are seeing voids, as big as the
