Electronics Forum: lead-free solder paste (Page 716 of 806)

Re: Pad Sizes

Electronics Forum | Wed Dec 30 16:04:15 EST 1998 | former co-worker of yours

| I need advice on a pad design which several other engineers whom I work with would like to try. I think it is an utterly crazy but I can't seem to convince them differently. | | My current 0402 chip pad sizes on alumina and FR4 substrates are .

Selective wave selection

Electronics Forum | Mon Apr 01 19:57:07 EST 2002 | davef

Selective soldering machines are a good way to "finish automation", if the design of the PCB is conducive to the application with just a few components to solder. Your points are good. A decision matrix for selecting a machine might also include:

Soldering issues lately!!

Electronics Forum | Thu Sep 11 11:45:28 EDT 2008 | realchunks

At first glance you would think so. But just as in real life manufacturing, EVERY problem can be solder related. Naturally the problems with broken parts, wrong parts, parts made wrong etc... are generally found right ways, so no one really posts t

Re: MicroBGA qualification process

Electronics Forum | Thu Mar 30 21:46:56 EST 2000 | Dave F

Reg: This is copy / paste from draft version of IPC 7095 ( issued May 1999 ) ... 7.3 Assembly accept/reject criteria 7.3.1 Voids in solder joint a. Sources of Voids There can be voids in solder balls, or at the solder joints to the BGA, or at the so

Re: uBGA

Electronics Forum | Tue Jul 13 15:04:24 EDT 1999 | Scott McKee

| | | | Hi all , | | | | | | | | We are trying to implement the micro-BGA technology at our plant. I need the clarification to the following points: | | | | | | | | 1. Is underfill required for micro-BGAs? | | | | | | | | 2. What type of stencil a

Solder wetting test for PCB's

Electronics Forum | Mon Apr 23 17:30:08 EDT 2001 | davef

Step 1: Print paste on the board, skip placement, reflow the board, check solderability. Step 2: Goto Step 1. White Tin Solderability: The most common reason for solderability issues with the white tin surface coating during multiple thermal excur

Wicking-solder found under mask

Electronics Forum | Fri Jul 06 18:19:41 EDT 2001 | davef

The senior staff have the pictures!!! Oh, that�s just GREAT!!! What the blank are these gerbils doing with �em? Nothin�!!! They�re probably sitting in a folder on whatzisname�s desk, until he has "a change to study them more". [Like he�s going t

Re: SMT Zero-defect Soldering

Electronics Forum | Wed Dec 01 22:34:32 EST 1999 | Dave F

Mark: Ralph Woodgate is a "god" of solderability control programs. We have: � Been attending his seminars for, maybe 8 to 10 years ... who keeps track when you�ve been breathin� fumes that long? � Three different editions of his "Handbook Of Machi

Re: Dull Solder

Electronics Forum | Fri Nov 12 08:55:43 EST 1999 | Wolfgang Busko

Hallo Edmund, what does dull mean in your case ? It�s nearly impossible to say something about it without more information. Dull or shiny isn�t a clear or better no indicator for good or bad. Some companies add other metalls to the solder to get rid

Re: HELP!! via sizes, location

Electronics Forum | Tue Oct 05 12:42:43 EDT 1999 | Chris May

| I am a new employee at a company that has had a large turnover of employees over the past year. I am working on a board (components on one side only), the engineer (he is also new ) wants to use an .035 pad with a .021 dia. hole, there are no via's


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