Electronics Forum | Sat Aug 01 12:06:52 EDT 2009 | isd_jwendell
Unfortunately, I don't see any image. If your part will survive 300C then even convection reflow should work. The use of paste and reflow ovens are for when you move to production quantities. It sounds like you could hand solder your prototypes (proo
Electronics Forum | Wed May 22 19:10:47 EDT 2013 | anvil1021
We do a lot of these devices and I guess I am not familiar the term "Dry Solder". The QFN device is not designed to have a drain hole, but needs to have thermal vias to control heat in most cases. We have used every possible gnd pad design and modifi
Electronics Forum | Wed Jul 15 03:20:51 EDT 2020 | wellmanrau
Dear Sir: We have the coating machine with good performance and price for market promotion. We have been producing the SMT machines and intelligent equipment for many years, integrated Design, R&D, Production, Sales and Technical Service. What produc
Electronics Forum | Tue Jan 23 22:38:43 EST 2001 | rpereira
I have recently completed a HUGE screen-printing DOE. I used Taguchi methodology and man I got good results! Here is what I learned for what it's worth: (p.s. to the MPM apps guy I sent a copy to Tim Gillis, Lou Fuda, etc...) EFab vs. Laser: EFab
Electronics Forum | Sun May 21 05:54:04 EDT 2000 | Sal
Currently manufacturing double-sided PCMCIA cards with a nickel/gold finish, which are 0.0235thou in thickness, using surface mount carriers. Problem we are seeing is when building the densely populated side on the second pass we are seeing lifting o
Electronics Forum | Thu Mar 01 10:46:11 EST 2001 | davef
Various lint free stencil wipe suppliers take various approaches to stencil cleaning. For instance ... Techspray Directions: Start with a dry TechClean Wipe (2358, 2361, or 2362) to remove excess solder pastes. Follow this with the 1608 Pre-Saturat
Electronics Forum | Thu Jul 20 16:10:34 EDT 2000 | armintan
Hi Bob, From my memory about almost 4 yrs. ago, I remember we did something similar to this in Apple Computer Singapore. Process sequence are: Bottom Side Process: Print Solder Paste(Dek 265GS) Dispence Adhesive (Cam/Alot 3800) Place Components (
Electronics Forum | Fri Aug 03 05:13:01 EDT 2001 | mugen
Well none of us, really know whether, this 0805 CAP is really an unsolder/tombstone defect, coz none of us verfied this with, our own eyes *duh* Funny, this only happened for us, on 0402 ~ 0201 SMD.... Check your land-pad design specifications, if
Electronics Forum | Tue Dec 07 16:34:54 EST 1999 | Russ
Wolfgang, I appreciate your continued feedback! The main reason that I shortened the Time Above Liquidous (TAL) was it appeared that I was burning off all of the flux from the paste. By shortening the TAL to 45 seconds and decreasing peak temp to
Electronics Forum | Tue Aug 24 05:11:32 EDT 1999 | George Verboven
| | Hello everyone, | | We found many cylindrical diodes missing during SMT process. Could someone tell us how to prevent this problem? Is it effective to change the shape of stencil apture or reduce fan speed in reflow oven? Thanks in advance. | |
