Electronics Forum | Fri Nov 12 07:42:38 EST 1999 | Michael
We are looking for AOI for post solder inspection with short setup times for high mix assembly. Also the solder joint of J-Lead components should be inspected. We found two suppliers for such systems, Orbotech and Viscom. Can anyone help us to det
Electronics Forum | Sat Nov 06 14:39:50 EST 1999 | Gary Moravchik
I am seeking sources of reliability and thermal stress data that compares BGA (50mil ball pitch) to QFP (20mil lead pitch)packaging for automative applications. Substrate material is epoxy glass. The ultimate goal is to collect sufficient data to hel
Electronics Forum | Wed Sep 22 10:55:37 EDT 1999 | Craig J.
I am attemping to gather as much information on the issues with and progress in solutions for manufacturing Pb free products in response to European initiatives (WEEE). I am intereested in component issues with As Made lead terminations (no Sn/Pb) a
Electronics Forum | Tue Sep 14 20:21:19 EDT 1999 | Pat Copeland
I am looking for help on doing smt equipment qualifications. I need to find some examples to follow. The equipment to be qualified is a Stencil Machine, Pick and place machine, and Reflow oven. We manufacture medical devices so it has to be somewhat
Electronics Forum | Wed Sep 01 18:26:10 EDT 1999 | Lauren Cielo
Certain ICs cannot be place by our pick and place machines and therefore operators place them by hand. Has anyone seen some type of dispensing material handler that would ensure we don't bend the leads of this fragile devices? I'm envisioning some so
Electronics Forum | Sat Aug 28 09:23:36 EDT 1999 | Mike McMonagle
| I have looked through the IPC web page and surfed to frustration. Can somebody give me a lead? | Check out the EasyBraid website below, they carry IPC standard coupons, flux test kits and SIR meters at reasonable prices.
Electronics Forum | Wed Aug 18 10:28:17 EDT 1999 | Carol Zhang
Hi, I'd like to ask some tips about the merits and shortcomings o of both screen printer and stencil printer. For small quantity and highly mixed usage, which type of printer is suitable to our application? The boards contain no BGA and the fines
Electronics Forum | Mon Aug 16 15:39:59 EDT 1999 | Earl Moon
| We have a design on which there is an ASIC that will not be produced anymore in the future. As we want to make this design over the next 10 years we are evaluating the possibility to buy the necessary ASICs for the next 10 years. This will give us
Electronics Forum | Wed Aug 18 05:09:56 EDT 1999 | Brian
| | We have a design on which there is an ASIC that will not be produced anymore in the future. As we want to make this design over the next 10 years we are evaluating the possibility to buy the necessary ASICs for the next 10 years. This will give u
Electronics Forum | Thu Aug 12 18:43:49 EDT 1999 | Wayne S.
Hello Having a problem with bridging on 20mil pitch qfp, only on the lead groups where squeegee goes over width of apertures. Using MPM sp-200 semi-auto, chem-etch stencil, 9-10mil width opening 100 durometer blade. Getting "tails" on deposits. Trie
