Electronics Forum | Mon Jan 13 15:20:04 EST 2003 | JohnW
Russ, unfortunately at the moment the preferred option of hi melt isn't available due to copyright issues. The current ball is made of 46/46/8 tin / lead / bismuth. ther ball's are 0.8mm in dia. The alloy actually has a plastic region around 170 and
Electronics Forum | Tue Jan 21 11:03:15 EST 2003 | MA/NY DDave
Hi You already received good answers. A thing to remember is the components and the PCB. How high you go above 63/37's 183C should be limited to create a good solder joint. Too long creates problems since the components and the PCB start to be he
Electronics Forum | Fri Jan 24 17:00:56 EST 2003 | razan3
RMA needs to be dry prior to the wave to work. If coverage is good and part orientation is good, then you should be okay. Pad size can be adding to the amount of material left as well. Granted it soldered before fine with .2 long leads, I would di
Electronics Forum | Tue Feb 04 19:53:50 EST 2003 | joeherz
Hello All, I've come across this machine and have no experience with Streckfuss other than the little radial "trim only" unit. Does anyone own one of these? Good, bad, ugly? The one I found is going for $2.5k and has a good selection of dies.
Electronics Forum | Tue Mar 11 09:26:36 EST 2003 | jseagle
Dave, Not sure if I understand the question. We do not process No-Clean in our facility at the current time. We are a completely Water-Soluble with a 12 year old Hollis Polyclean In-Line washer. I need to scrap the piece of ****. That's another
Electronics Forum | Tue Mar 04 00:55:12 EST 2003 | nifhail
In the double sided SMT process assembly, normally the bottom side will be processed first, due to it's lesser density as well as it's lesser heavy components. Apart from worrying about the component falling down, what are the potential problems that
Electronics Forum | Wed Mar 05 09:34:32 EST 2003 | HAROLD LICHT
WE HAVE A NEED TO BOND SOME LOW TEMPERATURE LED'S TO A THIN CIRCUIT BOARD LAMINATED TO A HEAT SINK. HAS ANYONE USED AN ULTRASONIC WELDER TO WELD COPPER GUL WING LEADS TO A COPPER PAD USING ULTRASONICS? IF NOT HAS ANYONE USED RESISTANCE SPOT WELDING
Electronics Forum | Mon Mar 24 16:36:51 EST 2003 | ksfacinelli
I am still searching for an off the self option. Erem use to make to tool except they have obsoleted it from their hand tool line. I would rather not by a die set as the qty is very low. Any more suggestions would be greatly appreciated as well as
Electronics Forum | Tue Mar 25 11:48:10 EST 2003 | ksfacinelli
David, I am with you on the redesign recommendation except we are building a certified piece of equipment that cannot be easily altered. We have given recommendations for the future manufacturability but as we in manufacturing are all to aware thes
Electronics Forum | Sat Mar 29 08:42:25 EST 2003 | davef
YiEng, MA/NY DDave There are numerous package types that now fall under the rubric of land grid. Land grid devices [ie, BCC�, LGA, QFN, MicroLeadFrame�, etc] are essentially BGA devices with the balls removed and with no solder on the pads. General
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