Electronics Forum | Mon Aug 08 06:17:09 EDT 2005 | Hi Steven
My suggest is using Ersa IR55A or IR650A. http://www.ersa.de/en/ If you looking for your quality, you need this system. I had try it many time, is better then hot air. and you can set the profile as you like, even Flat Peak on the Lead Free Rework.
Electronics Forum | Thu May 06 08:59:25 EDT 2004 | davef
Even with PbSn solderpaste the leadfree BGA's have a superior resistance to solder-joint fatigue failure when compared to conventional parts. [Solder Fatigue Reliability Issues in Lead Free BGA Packages, Pedro Chalco of IBM, Pan Pacific Microelectron
Electronics Forum | Thu May 06 10:52:08 EDT 2004 | John S
Many component manufacturers are moving to Pb free terminations. I've been doing a literature study of Pb free processing and have found several articles that indicate Pb-free paste with Sn/Pb terminations leads to early fatigue failures. Does anyo
Electronics Forum | Tue May 18 09:18:34 EDT 2004 | Vinnie
interesting, Are those Allen Keys going to someone else pockets???? Have you put a lock on the tool box??? and or assigned them to a lead person or whoever incharge for that line??? if so, Heads must roll. Stealing person won't bring any good q
Electronics Forum | Thu May 20 09:20:08 EDT 2004 | jsk
Voltage checks out ok after i unplug the monitor and unplug the dc voltage suppy to the y1 enclosure. I lose the 24v and 5v line completely when i plug these in and voltage drops on the +12v and -12v, which leads me to believe a bad power suppy. What
Electronics Forum | Fri Jun 04 18:18:28 EDT 2004 | gabriele
Hi Ricardo, You should complete the question with more details like : - kind of components pkgs (Chips, SO,TSOP,QFP,BGA,CSP,etc) and % of them versus the total (400) - tech complexity of components (0402 ? Finest Lead and ball Pitch ? SMT conne
Electronics Forum | Wed Jun 16 23:41:31 EDT 2004 | rodionp
ricardof Unfortunately I cannot comment on many of your questions however I can lead you to one important article as to basic assembly optimization techniques to maximise throughput (or minimize assembly time, which is pretty much the same thing...)
Electronics Forum | Mon Jun 07 14:47:22 EDT 2004 | Mark
It matters on how you setup your oven profile. I have placed J-leads on both sides with no problems. Also, have come across some fine pitch but wouldnt suggest this too often. Give some examples that he would like to see placed on the bottom side of
Electronics Forum | Mon Jun 07 21:31:46 EDT 2004 | davef
That's thin board. The test that you ran is the best method for determining the specific answer. Bob Willis says, "Use pad mating to lead wetting area. Some have found the ratio to be as much as 44 grams/sq in." Bob Willis and Phil Zarrow have po
Electronics Forum | Tue Jun 15 12:54:34 EDT 2004 | jsmith01
It seems like the break is happening between the sn and ni. The parts are dull in appearance will not take solder even with an iron after they come off so it leads me to believe that there is only ni left on the part. The parts are liquidous for ab
