Electronics Forum | Thu May 01 13:56:45 EDT 2003 | kmorris
Dave: After the stencil was made with apertures for a connector on this PCB, it was discovered that the connector would have to be handsoldered after SMT reflow. If the solder deposits are left to reflow on the pads, it makes it difficult for the o
Electronics Forum | Tue Jul 08 18:53:21 EDT 2003 | MA/NY DDave
Hi The answer in general is no mixing of Lead Free with Sn/Pb solder. If you look at reliability data, failures after stress tests and then SEMs, failures occur at grain boundaries inside the joint. Lots more happens. By the way this mixing happe
Electronics Forum | Fri Jul 04 08:57:59 EDT 2003 | davef
If you think you have an intermetallic, soldering as probably done correctly. In that case, expect the solder to fail in the solder, just above the intermetallic. This the weakest portion of the solder, because the tin has be depleted to form the i
Electronics Forum | Thu Jul 03 18:14:03 EDT 2003 | russ
Kris, I don't know what I HAVEN'T SEEN yet cuz I haven't seen it. (HAHAHA) It is kind of like when you are looking for something and you always say after you found it that it was the last place you looked (Why would anyone keep looking for something
Electronics Forum | Wed Aug 06 21:47:25 EDT 2003 | Francisco De La Torre
I looking for some information about Lead cutting and forming equipments. In specific PPM information abour Tape feeding vs bowl feeding. For TO-92 components. Actually we have a tape feeding system and we have like 15000 PPM's, and we measuared the
Electronics Forum | Wed Aug 20 21:30:56 EDT 2003 | paulm
Our company if currently reviewing our BGA Screen Printing Process. The problem we are trying to eliminate has to do with BGA Ball Size Variance. Some of our vendors are allowing a +/- of 0.004" in ball size. This would allow for the possibility of a
Electronics Forum | Thu Sep 04 10:24:39 EDT 2003 | paulrm
The typical PIP process is incorporated into the surface mount process. This approach requires the following: The stencil will be designed so that the correct amount of solder paste can be printed onto the through-holes to form an acceptable joint
Electronics Forum | Tue Sep 16 10:15:33 EDT 2003 | Gabriele
Hi James, is it your oven a convection forced air ? if yes you should check if air flow speed is too high. Also, some time ( do not smile pls !!) it could be a metter of magnectic field inside oven tunnel. The SOT leads are normally madeby A-42
Electronics Forum | Thu Sep 25 18:37:36 EDT 2003 | adlsmt
Grind the point on a pogo pin from an in-circuit test fixture flat and push on a leg of the component till it bends, mark the deflection, then add about 30% to the length that the pin pushed in (maybe more if your using no clean and the residue adds
Electronics Forum | Thu Sep 25 19:38:26 EDT 2003 | lysik
I would like to start a new web site that tracks, monitors etc the policy and hostile blackmail type license fees and support policies of ICT and PCB assebbly equipment companies. I would also like to have a forum where people can log their experienc
