Electronics Forum | Thu Sep 16 09:29:21 EDT 2010 | san_1023
Weller and Hakko have some good soldering > stations, hot air SMD rework system and BGA > rework systems: _a class=roll > href="http://www.wellersoldering.blogspot.com/" > target="_blank"_http://www.wellersoldering.blogspo > t.com/ _/a_ I am t
Electronics Forum | Thu Sep 16 17:56:48 EDT 2010 | asksmt
Ok Thanks, i have reduced thermal pad size by 4.5 mils on top and bottom part of this footprint where the problem was occuring, so now the clearance between thermal pad and lead pads are 12 mils instead of 7.5 mils on two sides. (i kept the signal pa
Electronics Forum | Fri Oct 01 10:05:29 EDT 2010 | rrpowers
You don't necessarily have to bake the flex circuits, but you do have to worry about moisture. Polyimide is very hydroscopic, and depending on the flex construction, any moisture in the product can lead to delamination. Adhesive based flex circuits
Electronics Forum | Wed Nov 10 16:19:51 EST 2010 | davef
The 5 thou standoff of your SOIC is probably the minimum. We wouldn't be surprised to see 10 thou. With this, you could have maybe a 6 thou gap between printed solder paste and the bottom of the heat slug. So, you're expecting the rabbit ears of p
Electronics Forum | Mon Dec 20 04:41:38 EST 2010 | accuspares
Hi, The input indicators can be located by selecting the 'Input' page located in the 'Diagnostics' drop down menu. Just select the Align tab at the top of the page and you'll be able to see when the nearly home and home sensors change state. The pr
Electronics Forum | Tue Feb 01 10:11:36 EST 2011 | clampron
good Morning, it looks from the peak temperature that this is a RoHS application? If so, is the BGA that you are having issues with leaded? If so, you might be experiencing "ball drop" where the ball becomes disconnected from the component substrate
Electronics Forum | Fri Jan 28 09:03:43 EST 2011 | ldavis
Shannon, We have been using VP for all of our lead free production since 2007. Here are the items I can think of off the top of my head. Pro's - small footprint, minimal profiling needed once machine is understood, oxygen free soldering process, s
Electronics Forum | Mon Mar 21 12:49:16 EDT 2011 | Nigel @ Rakon
I am having issues with Solder balls on Ceramic devices, all LEAD FREE SOLDER. The cermaics are only 7x5mm in size. The balls appear around the 0402 capacitors. I have a varying humidity from 15 to 40 %rh which is slightly low but I cannot control.
Electronics Forum | Tue Apr 05 14:42:41 EDT 2011 | clampron
Bigvern, We have had the same problem on two different occasions. Both issues were caused by the vacuum sensor. The first time this happened, we had a tech from Dage in to repair. This was fairly costly. When it happened again, we opened the cabinet
Electronics Forum | Wed Apr 27 08:19:41 EDT 2011 | charliedci
We are in the process of changing over our wave solder flux from alcohol based no clean to VOC free water based no clean. We are running an old Eletrovert with foam fluxer, tin lead solder. After preliminary testing on scrap boards and now starting t