Electronics Forum: lead (Page 596 of 789)

IPC 7530 section 7.3.1.1 Regarding K type thermocouples

Electronics Forum | Sun Sep 29 13:04:58 EDT 2013 | KIC-Tech Service

Sr. Tech, As far as I’m aware, most if not all, manufactures of thermal profilers offer K type thermocouples as a standard for profiling in the electronics manufacturing industry. In my decades of experience in the reflow and wave solder industry, t

ERSA users 1.8/2.5 nozzle

Electronics Forum | Thu Nov 14 10:24:53 EST 2013 | jaimebc

Recently, we have been experimenting with the 1.8/2.5 nozzle to be able to solder leads that are near an SMD. This pcbs were not design for selective solder, so we are trying to work within this limitations. I found the 1.8 nozzle very hard to insta

Delamination effect in FR1 type PCB (Lead free soldering)

Electronics Forum | Mon Jan 06 17:37:54 EST 2014 | hegemon

Make sure you are providing an adequate moisture bake out prior to wave soldering. It sounds moisture related since is so random. I would suggest perhaps 120C for a minimum of 8 hours to drive the moisture out, and then complete your wave soldering

01005 Qualifications - Lead Free

Electronics Forum | Fri Jan 24 16:54:24 EST 2014 | davef

Yeh, I worked at Wang Computer factory in a reclaimed fabric mill with wooden floors. One of the causes of grapping is flux loss. In their paper, Briggs and Laskey talk about flux loss due to spreading and suggest: * Graping is much less prevalent i

seperation of soldermask and pcb

Electronics Forum | Tue Mar 25 13:55:05 EDT 2014 | horchak

Ok lets put it this way. If the PCB house used a high quality mask and properly applied it to a properly cleaned surface and properly cured it, then as Dave stated above there are only two things that can destroy it. Excessive heat and overly aggress

Incomplete reflow

Electronics Forum | Fri Apr 04 18:16:43 EDT 2014 | garym4569

We are in the process of launching a new product and found reflow solder issue with one of the inductors. I have set oven profile to paste specifications. I just finished profiling with thermocouple under problem component. All other components ex

OSP and getting full pad wetting??

Electronics Forum | Fri Apr 18 14:25:51 EDT 2014 | horchak

what is the technology? Is there fine pitch, double sided, number of layers, lead free? If the pcbs are not of the highest quality you may be set up for failure with no clean process. Couple things to look at is your paste flux content versus medal

low thermal emf solder & paste - SAC 405

Electronics Forum | Mon May 12 04:26:00 EDT 2014 | gazelle

Hello - I am looking for a source to supply low thermal EMF solder - can anyone provide pointers ? In the past a cadmium - lead alloy was used for this, but these are banned (RoHs) ... - the aim is to minimize thermo-couples on a very sensitive 4 lay

BGA drop off from the boards

Electronics Forum | Fri May 23 09:27:37 EDT 2014 | emeto

Hello, these pads look so clean.....I am not sure you had a good solder connection there. I would check the following. 1. Is the part RoHS in a lead process 2. X -ray boards after reflow(I assume you will see head in pillow) 3. Check for board con

BGA drop off from the boards

Electronics Forum | Fri May 23 23:45:38 EDT 2014 | edriansyah

Hi Evtimov. 1. yes both part and the process are lead free/RoHS 2. I ever did X-ray, the balls shape are good and I dont see any evident of head in pillow (but my x-ray machine is not too good) Head in pillow was also my first suspect. but after the


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