Electronics Forum | Fri May 03 06:03:26 EDT 2002 | geoff_goring
Dave Many thanks for your very informative piece on SMT.com As we stand we have not yet 'seen' any problem. My issue is that we have ordered (LTB) a very large quantity of ASICS and our usage has taken a down-turn. We therefore need to keep the one
Electronics Forum | Fri May 03 18:55:41 EDT 2002 | davef
Interesting situation. Everything [ie, intermetallic compounds, solderability, etc] is speculative without knowing more about the materials of: * Leads. * Solderability protection. ... because suppliers use a fairly wide of materials. Your suppl
Electronics Forum | Wed May 15 13:11:26 EDT 2002 | fmonette
Hi Dason, Yes I was talking about the same paper. This is the best technical information available to clearly explain the physics of moisture diffusion inside a plastic package. Many of the guidelines contained in the current J-STD-033 are derived
Electronics Forum | Wed May 22 21:01:49 EDT 2002 | davef
Ah, the customer is always correct, again. And you are officially �painted into a corner�. Actually, your customer is not correct. Thinking that money is going to be saved by specifying copper component terminations [or whatever in the world they
Electronics Forum | Wed May 22 13:40:24 EDT 2002 | Hussman69
Boy, I step out for a bit and everybody picks on me (just joking). I believe I may have been off base a bit. Checking every bit of your stencil design is very good - I do that too. I calculate LXWXH and reduce or over print where needed, depending
Electronics Forum | Fri May 31 08:51:09 EDT 2002 | zanolli
Hello Dave, As related to connector mating interface, fretting corrosion is the oxidation of the contact points, causing high resistance across the interface. Fretting corrosion is caused my micromotions in the interface exposing the metalized conta
Electronics Forum | Fri Jun 21 15:04:51 EDT 2002 | bentzen
Hi Greg. FujiCam has two ways of calculating the placement coordinate for a component. - The "FujiCam/Unicam way": calculating component origo as the center of the designed component pads. - Use the PCB designers part origo which could be center of
Electronics Forum | Tue Jul 02 12:10:06 EDT 2002 | fmonette
Dason, Just a word of caution about your experiment. Evaluating moisture content by weight gain is a very simplistic model, based on the assumption that the moisture content is uniform across the package. In fact, recent technical papers have cl
Electronics Forum | Wed Jun 26 08:54:53 EDT 2002 | davef
it has a lousy gage. * Solderability testing machines from different suppliers produce dissimilar results. * Tests don�t well represent in-use. For instance, how does one test the solderability of a BGA? [Ooo, ooo. I know the answer. => For BGA and
Electronics Forum | Fri Sep 13 06:18:55 EDT 2002 | yngwie
Here's a long survey....Pls help. 1) What is the general feel for via in pad for upcoming designs? - complete Via in pad - partial encroachment - via partially in pad 2) What are the manufacturing bare PCB's related concerns, issues and possible dr