Electronics Forum | Wed Jul 19 14:53:39 EDT 2006 | amol_kane
i think the most important thing to consider is the # of reflows. is this a double sided assembly? if so OSP degrades during the first LF reflow. also there are many studies out there that show the wetting on OSP is inferior to some of the other comm
Electronics Forum | Fri Jul 21 13:42:11 EDT 2006 | Chunks
Paste too thick. Paste not aligned on pad. Part not aligned on pads. Part leads not straight. Oven profile. Paste slump from warm board. Operator before oven thinks they can place IC better than placement machine - so plays IC hockey with part. Oven
Electronics Forum | Fri Jul 28 09:24:54 EDT 2006 | Chunks
Yur profile looks OK for a leaded paste. It may be tyour paste as stated below. Is this a new problem? Also, have you profiled your oven lately? Could be one zone out of control.
Electronics Forum | Sat Jul 29 08:52:09 EDT 2006 | davef
This recipe is nice for leaded soldering. The time above liquidous plus 20*C is too short for mixed alloy soldering. Remember all that nonleaded stuff that you add to the solder acts to increase the liquidous temperature of the alloy. Try slowing
Electronics Forum | Tue Aug 01 11:30:11 EDT 2006 | heyitech
We need to sold compnents on the copper board(1.5mm thick)by using lead free solder paste. please give me some suggestion if you have experiences on this issue. thank and regards
Electronics Forum | Thu Nov 09 15:28:10 EST 2006 | jdengler
A used equipment dealer. I think I posted a wanted listing in the Equipment Mart to get the lead. Jerry
Electronics Forum | Fri Aug 04 09:09:22 EDT 2006 | russ
Aj is right, utilize the homeplate aperture, this reduces the amount of paste actually underneath the component, Pb frees exhibit this mid ship more often than the lead, I think,it is mostly because of thre transition to noclean form water solubles
Electronics Forum | Thu Aug 17 08:44:38 EDT 2006 | McGill
I happen to be an old lead head from way back, and I don't agree with all this straight ramp garbage. This makes me so mad I'm going to do Tai Chi to calm myself down.
Electronics Forum | Wed Aug 09 04:20:19 EDT 2006 | Rob
If you kink the leads will you be able to insert it without flexing the board/moving any of the other components? Also these pin headers aren't always designed for this process so have you checked that it will take the elevated temperatures?
Electronics Forum | Wed Aug 09 08:59:52 EDT 2006 | zanolli
I agree with verifing this part is even high temp reflow compatible. The age of the original dwg release, 1986, and as there is no mention of high temp reflow compatibility, only a mat'l call out of nylon, leads me to think it is not.
