Electronics Forum | Tue Feb 27 03:35:23 EST 2001 | peterbarton
Steve, I have to support the comments made by Dave F. Provided the surface mount parts on the second side are correctly orientated and not too close to any adjacent through hole leads then the best option has to be to print glue then wave solder. T
Electronics Forum | Fri Apr 06 11:37:19 EDT 2001 | raton
We had the same problem years ago when we started using a radial inserter. The inserter would dutyfully insert and clinch the leads. The problem in our case was the component body sealing to the fab, especially on electrolytics caps with a film jac
Electronics Forum | Wed Apr 11 06:06:53 EDT 2001 | wbu
Hi Dreamsniper, the IPC land design standard is IMO a good reference. If you use the online calculator you can influence the result by varying for example manufactoring parameters. For the same lead width and same tolerances (and of course pitch) we
Electronics Forum | Thu Jul 20 16:15:24 EDT 2000 | Bob Willis
Sorry at the moment I do not have information but as usual I want to get some hands on sessions going. We were doing a flip chip workshop hands on session for Speedline last week in England. We did the theory and then hands on soldering and underfill
Electronics Forum | Wed May 09 11:25:29 EDT 2001 | medernach
What type of preheaters do you have on you're wave? I have to agree with Dave. Your leads are not cold, they are hotter than the annular ring on the PCB. This would cause the solder to go to the lead only rather than the component and land pad / a
Electronics Forum | Sun Jun 10 12:47:36 EDT 2001 | procon
Hi Jacob, NC vs WS, what a story! No-clean paste means no-clean for your products but what a mess it makes in your reflow systems. If you are a contract maunufacturer of high volume production, then No-Clean is they way to go. This helps keep your co
Electronics Forum | Fri Jun 22 11:54:47 EDT 2001 | jdtpfacreate
OEM Boy, This is an excellent question. Since I am on the "I-want-to-sell-you-equipment-side" I do not have the hands-on experience that you do but, I do have a many engineers back at our factory who have dedicated their lives to these issues.
Electronics Forum | Wed Jul 11 13:41:37 EDT 2001 | procon
Hi Chris, Dave F is absolutely correct in his assunption that the leads are hotter than the pads. You must profile from the pads to see the exact temperature that they are reaching. If the entire board reflows properly as you described, don't get ca
Electronics Forum | Thu Jul 19 22:42:04 EDT 2001 | jax
I assume since you talk about adjusting the locking pin and changing tooling you believe the part is not being held down with enough force while being reflowed. Is this because the insufficent and open solder you mentioned is the lead sitting on top
Electronics Forum | Mon Feb 07 13:40:41 EST 2000 | Dave F
Jose: Those are good guesses. Without knowing more, ask yourself: 1 There is probably adequate heat available, but that portion of the substrate that�s not soldering well is not receiving proper heating. Why is the component getting so hot, relati
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