Electronics Forum: leaded (Page 406 of 789)

Lead-Free qualification process

Electronics Forum | Mon Aug 22 10:01:17 EDT 2005 | rlackey

The list is not yet completed but I picked few > different component that our supplier are not > able to get in Lead-Free or problem to get > leadtime: Mfg Part : Zener Diodes BZG03 - MFG : > Phillips Mfg Part : PME271Y447M - MFG: > Evox-Rifa Mf

delamination test

Electronics Forum | Tue Aug 23 16:57:29 EDT 2005 | HOSS

50% of seeing it in a single pass. The only time we do this is if we have a board off the line that has delaminated. We'll run a sample of boards through bare to confirm that we have a bad batch. Even if we see no failures on the bare boards, we'l

HMP Lead free solder?

Electronics Forum | Wed Aug 31 03:35:41 EDT 2005 | Slaine

I have a through hole product that is currently built with HMP solder(93.5Pb,5Sn,Ag1.5). We then dip it in 60/40 SnPb to give a solderable finish as HMP tends to oxidise. We need the HMP as our Customers solder through reflow ovens. Some customers w

Presse for press-fit connector

Electronics Forum | Thu Sep 01 00:52:24 EDT 2005 | adlsmt

Depending on the connector you should be able to use a standard cheap arbor press with some cheap home-made tooling. Standard arbor presses typically have a rotating disc with cut-outs, remove this and put a decent quality stainless steel block in it

Component Loss in CP643

Electronics Forum | Thu Sep 01 08:15:51 EDT 2005 | jdengler

The 1CA0A009 would lead me to believe that the PD's may not be as accurate as possible. If the PD is bad then every location that uses that PD will have about the same error rate. The 12040403 would lead me to believe the feeders are haveing trouble.

Vertical fill solder

Electronics Forum | Thu Sep 08 06:19:55 EDT 2005 | lupo

Hello, Could anyone provide some support concern issue with vertical fill of through hole solder. Our lead free wave soldering process is not capable to fill 100% (requirement of our customer)through hole. We made everything (DoE) - different amoun

Help!!

Electronics Forum | Tue Nov 08 20:50:03 EST 2005 | davef

First, general comments about voiding in wave soldered connections are: * Causes of voids in solder connection are many: moisture, flux/paste volatiles, wave process, etc. * Impact on reliability of voids in a PTH solder connection is insignificant,

USING LEAD FREE PARTS WITH LEAD PASTE

Electronics Forum | Sat Dec 17 17:52:50 EST 2005 | Ola

I agree with You. We are in many ways in the hands of our suppliers; either it is a machine, components, paste, daily consume etc. etc. I can tell You some horrible cock-and-bull story that our suppliers tell us, especially now when the RoHS is new a

USING LEAD FREE PARTS WITH LEAD PASTE

Electronics Forum | Sun Dec 18 16:39:53 EST 2005 | grantp

Hi, Yes, and this is the problem with info from suppliers, and the problem is often companies market heavily against new technologies because they have issues with them, or problems not sorted out yet. Sometimes it's just the sales guys who don't un

USING LEAD FREE PARTS WITH LEAD PASTE

Electronics Forum | Thu Jan 05 15:42:26 EST 2006 | samir

Grant, The strength of the joint in a CCGA is the column for one...it's more ductile, made out of 90% Pb, and it's meant to compensate for the massive CTE mismatches between the ceramic and the board (ie the columns flex to relieve stress from the e


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