Electronics Forum: leaded (Page 431 of 789)

Profiling

Electronics Forum | Wed Jul 21 19:16:53 EDT 1999 | Dreamsniper

Which among the two profiling method is more reliable/accurate in getting the oven thermal profile? a) using a HIGH-TEMP solder wire then soldering the thermocouples onto the profile points of the board (e.g. component lead etc.) b) not soldering t

Through holes in SMT pads

Electronics Forum | Tue Jul 06 15:06:35 EDT 1999 | Mike Demos

Is anyone aware of some guidelines regarding through-hole in SMT pads? One of our designers wants to add through-hole leads in some SMT pads for an inductor. The size of the hole is 0.032 inches and takes-up approximately 25% of the pad area. This

Re: library

Electronics Forum | Tue Jun 22 16:17:20 EDT 1999 | Cunli

| Cunli: Chrys is not the only one. Check the following: | | "Lead Free Solders - A push in the wrong direction?" Dave, Thank you for letting me know. We will get in touch with the contributor right away to correct the entry. Looks like Chrys

Technology Road Map

Electronics Forum | Wed Jun 16 15:40:47 EDT 1999 | Jagman

I've been asked to put together a "Technology Road Map" that shows the direction components (technology) and the equipment that places them might be taking for the next 10 years. For instance, micro BGA might require more sophisticated pick-and-plac

quoting smt

Electronics Forum | Tue Jun 08 19:44:01 EDT 1999 | wayne sanita

I am interested in seeing how some of you quote smt work. Currently we quote off a bom without component packages known then look in data books to find out what type of component they are. This job will be mine soon but i really believe there is a be

Re: measuring pitch

Electronics Forum | Mon Jun 07 16:45:57 EDT 1999 | Dave F

| I was wondering what measurements are used to define pitch? | Frank: John's correct with the most common definition, but there can be others, depending on your perspective. TTYL Dave F Pitch. The center-to-center spacing between the (1) leads

Re: Intrusive reflow..from the bottom..????

Electronics Forum | Mon May 24 10:33:08 EDT 1999 | Jim Zanolli

Hello John: Teka Interconnection Systems offers an alternative to intrusive reflow for connectors. We can supply the connector with solder and flux pre-applied to each lead. Our system also includes a built in "solder stop" mechanism preventing th

Re: Need a land pattern

Electronics Forum | Wed May 12 02:22:03 EDT 1999 | Richard Durrant

| Need a footpint for a 10 lead uSOIC (RM-10) | Have you tried the IPC website at www.ipc.com, they have an online land pattern calculator that not only gives you there RLP (Regisistered Land Patterns) for standard components, but also allows you to

Experience with solder stop on components?

Electronics Forum | Tue May 04 05:06:31 EDT 1999 | Dietrich Habel

Does someone has experience with solder stop on components to avoid an Viking effect (no solder on the pad, all solder on the lead)? What kind of solder stop does work well? What is dangerous? What has to be kept in mind when using such components? B

cracking on Ni/Au plated pad

Electronics Forum | Thu Apr 22 07:51:32 EDT 1999 | Vic Lau

after soldering transistors on a flex circuit (Ni/Au plated), one of the lead lift-up from the pad. under microscope (1,000 X), i find some cracks on the the pad surface. with edx analysis, the surface is mainly nickel. have you ever encounter suc


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