Electronics Forum | Fri Feb 19 09:14:52 EST 1999 | Justin Medernach
| During inspection and test we find leads which do not get soldered. Some are because of insufficient paste, but with others everything looks right. This will only happen on 1 to 2 pins, and it is not isolated to a specific type of ic or location o
Electronics Forum | Tue Feb 16 12:14:12 EST 1999 | Gregg Reick
| Hope some of you out there can help me with this one. | I am getting feedback from our test department that they are showing opens on solder joints which have visually good wetting. The touch-up operators confirm that the joint looks good. All they
Electronics Forum | Fri Dec 11 16:06:18 EST 1998 | Michael Allen
G, You'll find at least one old thread in this Forum on dual-reflow if you do a search. I found one dated April 7, '98 (searched on "reflow"); this particular thread includes a discussion about the maximum weight-to-surface_area for successful dual
Electronics Forum | Fri Sep 18 11:26:37 EDT 1998 | Earl Moon
Talk To You Later | | | Ta Ta Ya La | | | Dave F | | | | I've even forgotten what I was going to say - but one thing I do remember is how valuable your ever present information is. | | This clean/no clean thing is getting more interesting every day.
Electronics Forum | Thu Sep 10 15:41:59 EDT 1998 | Chrys
| Is a machine available to straighten QFP legs | Where? | How much? | Anygood? Ben, Texas Instruments makes a way cool machine for straightening bent QPF leads. It's totally automatic. It'll pick'em out of waffle trays, do a vision inspect for, "t
Electronics Forum | Fri Apr 17 21:46:18 EDT 1998 | Matthias Mansfeld
I plan to design a multichip module which contains 1 chip with about 200 pads and 2 chips with about 50 pads, no other components.The whole module shall replace as intermediate solution a single chip CPU in QFP208. Thus, the MCM itself must have t
Electronics Forum | Tue Apr 14 09:01:36 EDT 1998 | Justin Medernach
| We are having some difficulty soldering a 240 pin Altera device. We use Alpha WS-609, a very generic profile for that solder paste, and a 6 mil stencil with laser cut apertures (1:1 ratio). This is a 20 mil pitch device (aperture size is 10 mils X
Electronics Forum | Wed Feb 25 12:55:23 EST 1998 | N.J Bateman
| | | I have been involved in SMT for only a few months so I am coming from a position of extreame ignorance. I have been asked to investigate the differences in soldering to components with Paladium coated leads vs the standard Tin_lead. I would
Electronics Forum | Wed Feb 25 12:55:15 EST 1998 | N.J Bateman
| | | I have been involved in SMT for only a few months so I am coming from a position of extreame ignorance. I have been asked to investigate the differences in soldering to components with Paladium coated leads vs the standard Tin_lead. I would
Electronics Forum | Wed Aug 15 13:40:55 EDT 2001 | rkevin
Just as there are a number of causes of solder balling there are also several factors which can lead to or encourage the formation of solder beads. - During the placement of the component solder paste may be squeezed out from underneath the compone
