Electronics Forum | Tue Jun 23 13:33:23 EDT 1998 | Ben Salisbury
| Ben: Nice answer, but what's a DOE? How do you run one? What other processes do you run DOEs on? Dave F DOE=Design of Experiment Tools used for DOE...Multi-Vari Charts,components search, Pair comparisons, Variables search,Full Factorials, B vs.
Electronics Forum | Thu Jun 04 09:29:21 EDT 1998 | Chrys
I have gold fingers that I want to mask when running over the wave without pallets. They're on the leading edge of the board. I recall seeing rubber boots that slid onto the fingers to mask them. Pop 'em on before the wave; pop' em off after and r
Electronics Forum | Wed Jun 03 21:25:33 EDT 1998 | John Allan
| Hello: | BACKGROUD: SMT components soldered on the top-side of boards that also require wave soldering have the potential to reflow during wave soldering. Reflowing these components during wave soldering is not good. It can cause cold joints, op
Electronics Forum | Thu Jun 04 08:32:21 EDT 1998 | Dave F
| | Hello: | | BACKGROUD: SMT components soldered on the top-side of boards that also require wave soldering have the potential to reflow during wave soldering. Reflowing these components during wave soldering is not good. It can cause cold joints
Electronics Forum | Wed Jun 10 17:30:44 EDT 1998 | FAC
When creating part data�s for BGA or QFP style components, the line scan camera will be utilized (Camera No. 4). Using a Single nozzle type placing head, a nozzle capable of sufficient vacuum, and front lighting the part can achieve placement of a 74
Electronics Forum | Wed May 20 22:52:37 EDT 1998 | Dave F
| I'm looking to increasing my prototyping capabilies by getting some automated pick and place equipment etc. Any leads on where to start investigating? I'm a very small job shop with 5 employees. Any help would be greatly appreciated. Greg: Le
Electronics Forum | Mon May 18 16:31:59 EDT 1998 | Jerry
.025" pitch so the only problem we run into is too much HASL on the adhesive side causing improper glue dispense. As Earl keeps saying HASL thickness is hard to impossible to control. I think we need to look hard at OSP's again but then you get into
Electronics Forum | Tue May 19 02:59:46 EDT 1998 | P.L. Sorenson - Technical Consultant
| We had some failures on an IC package that the manufacturer has put down to moisture inside the package, leading to popcorning. | This seems a bit odd, the package is a PLCC 84 which is quite thick. I have only seen this problem on thin packages. |
Electronics Forum | Fri Apr 10 14:10:13 EDT 1998 | Jim Hoxie
We are having a bridging problem with SOIC 14,16 and 20 pin devices during flow solder of the bottom side of our boards. This bridging occurs about half way up the lead between the board and the body of the IC. The chip parts are no problem. The f
Electronics Forum | Fri Apr 10 14:08:51 EDT 1998 | Jim Hoxie
We are having a bridging problem with SOIC 14,16 and 20 pin devices during flow solder of the bottom side of our boards. This bridging occurs about half way up the lead between the board and the body of the IC. The chip parts are no problem. The f
