Electronics Forum | Thu Sep 25 18:37:36 EDT 2003 | adlsmt
Grind the point on a pogo pin from an in-circuit test fixture flat and push on a leg of the component till it bends, mark the deflection, then add about 30% to the length that the pin pushed in (maybe more if your using no clean and the residue adds
Electronics Forum | Thu Sep 25 19:38:26 EDT 2003 | lysik
I would like to start a new web site that tracks, monitors etc the policy and hostile blackmail type license fees and support policies of ICT and PCB assebbly equipment companies. I would also like to have a forum where people can log their experienc
Electronics Forum | Wed Oct 01 13:39:13 EDT 2003 | arturoflores
They take the solder in a dip and look solderability test but when in normal reflow process we got some pins that do not get wet and the appearance is as follows: -Pillow effect on the toe(no front fillet is formed) -There is a sheet of flux between
Electronics Forum | Mon Nov 03 23:32:15 EST 2003 | Grant Petty
Hi, Does anyone know of some good software for managing component consumption in manufacturing and keeping track of what products use what components, and the consumption rates over time. This lets us forward plan component orders for future product
Electronics Forum | Thu Nov 06 09:10:13 EST 2003 | successmani
hi, NEMI recommends separate solders for reflow sodlering and wave soldering. Reflow soldering- Sn-3.9Ag-0.7Cu Wave sodlering- Sn-0.7CU Wavesoldering- Sn-0.7Ag What will happen if a mixed technolgy PCb board containing both through hole and surface
Electronics Forum | Sat Nov 08 10:04:26 EST 2003 | severs
Once you have selected your plating based on electrical and physical requirments, you should know that there is an inexpensive plastic storage packaging developed by Lucent which can keep any platings solderability from degrading for up to 10 years o
Electronics Forum | Thu Nov 20 09:19:01 EST 2003 | markhoch
What do they say? Not too much as of yet. (I haven't actually recieved them yet.) The parts are being custom made by my customer. I've already bought my stencil, so I'm thinking I'm just going to try and stencil the tacky flux right on the pads and p
Electronics Forum | Thu Dec 18 21:36:03 EST 2003 | pdeuel
Blade angle, print speed, squeegee pressure, should be used in conjenction with one another. The more parellel the blade is to the stencel the more it will tend to float over the solder and the more paste is forced thru the appature. Contrary the gre
Electronics Forum | Thu Dec 25 02:48:45 EST 2003 | Grant Petty
Hi, Thanks for the info, and I will follow up on that. For everyones info, I did a google search and found a company called Passive Components who had most of what we needed in stock, so we did an order via them. We will see how it goes. Lead tim
Electronics Forum | Tue Jan 13 01:20:31 EST 2004 | mantis
Hi All, I have seen this issue on a QFP160.Firts of all as previously suggested if the board is wave solderded make sure that you are not seeing topside reflow as the board goes over the wave.Secondly you should verify your reflow profile.I seen this
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