Electronics Forum | Thu Oct 16 11:15:53 EDT 2008 | davef
A good solder connection with heavy ground plane requires: * Plenty of heat [Is the preheater located too far from the wave? Whenever you look at board temperature, there is a sharp decrease in temperature between the preheater and the wave.] * Conta
Electronics Forum | Sat Oct 18 09:30:43 EDT 2008 | hussman
Sounds like a part problem. You can SOMETIMES over come this with a hotter profile. We see this a lot with brokered parts. Seems like a lot of people are rejecting parts because a lot of companies haven't perfected their RoHS process, yet produce
Electronics Forum | Wed Nov 05 18:39:06 EST 2008 | joeherz
Hello, We have recently installed a selective soldering machine and are seeing some voiding/cratering in random locations. We have done some basic experimenting with fluxing parameters, preheat and dwell times but haven't been able to eliminate it.
Electronics Forum | Fri Nov 07 23:40:41 EST 2008 | padawanlinuxero
I have been working on the SMT area for a while now, must of my experience is on programming and pick and place, now in my new job I have to control a complete SMT line and I have a little knowledge on working with solder paste but I like to read mor
Electronics Forum | Wed Dec 24 11:49:46 EST 2008 | bandjwet
Put on your thinking caps for this one......We are trying to remove a BGA (10 x 10mm, plastic, 0.8mm pitch) which is approx 3 mm next to another BGA (5 x 5mm, plastic, 0.8mm pitch). The challenge is this second device is underfilled with a softening
Electronics Forum | Sun Jan 25 17:40:16 EST 2009 | cuperpeter
Hello All, I have a problem with nonwetting Au finish after second cycle of reflow soldering doublesided boards. Solder nonwetted pcb pads (is wicked to component terminations) Either these pads or some of non component pads became discoloured from
Electronics Forum | Tue Feb 03 16:42:50 EST 2009 | cuperpeter
Hello All, > > I have a problem with nonwetting Au > finish after second cycle of reflow soldering > doublesided boards. Solder nonwetted pcb pads (is > wicked to component terminations) Either these > pads or some of non component pads became
Electronics Forum | Wed Feb 04 03:20:05 EST 2009 | smartasp
Hi All Reflow Gurus I have learnt that my process engineers do not consider the heat resistance, of the components when creating a reflow profile but rather try to stick to the paste recommendation. This has lead to a field recall as one component h
Electronics Forum | Wed Mar 04 11:16:25 EST 2009 | patrickbruneel
From your description of the problem first reduced SIR to dead short is exactly what happens with dendrite growth. What is needed to form them is low bias voltage (10 volt range is ideal with low current), a surface, 2 conductors (containing tin), io
Electronics Forum | Mon Apr 06 11:53:50 EDT 2009 | ed_faranda
Here are some pictures of the part. I created a profile for this part. I've been in touch with the vendor and he seems to think the profile is too hot. I am waiting for another board from R&D so I can work on it again. If you look at the picture,
