Electronics Forum | Sat Feb 11 12:12:24 EST 2006 | johnw
Its just not worth considering when you can , purchase a lead free designed Machine in Europe for not much more than the conversion this what we have done we have purchased our secnd Nousstar machine Nousstar NS-350-TW-LFI n2
Electronics Forum | Wed Oct 05 19:36:46 EDT 2005 | Ken
Let me re-phrese. I walk up to a rack of boards in the factory. How would I know if it's lead free or not? I send you (my customer) an order of boards. How do you tell if its lead free or not (visually).
Electronics Forum | Mon Oct 17 16:49:51 EDT 2005 | barryg.
We may also be in the market for an oven that will be cabable of doing lead free assemblies. I am assuming that this thread is based on ovens that will be capable of lead free. How many zones would you guys recommend for leadfree. I have heard of req
Electronics Forum | Tue Nov 08 16:56:23 EST 2005 | Erik
Being a mostly-government contract house, we bought an XRF for R/I to inspect for the PRESENCE of lead in components. No matter which brand you get, they are all easy to use and relatively fast. We were very impressed with the software capabilities
Electronics Forum | Thu Nov 03 10:49:11 EST 2005 | russ
This is what I would propose, Place and reflow the board without the BGA with your lead process, remove the solder from the BGA pads if you cannot mask off the apertures in your stencil. Then place the BGA and reflow to SAC requirements with a rewo
Electronics Forum | Thu Nov 03 12:52:23 EST 2005 | Amol
the only problem i see here is the neighboring components (depending upon the component density) will surely undergo a second reflow during the rework stage for the BGA. this way the only lead you will have in the BGA assembly is if you are using HA
Electronics Forum | Wed Nov 23 00:22:30 EST 2005 | mskler
Thanx for your only reply!! I already increased temprature now its actualy on board is 240*c. I would like to discuss one more thing if I go for lead free solder paste & using some components wich are not lead free then what will be the result. Has a
Electronics Forum | Sun Dec 11 08:13:27 EST 2005 | stepheniii
If you are taking off the old BGA then the board finish is not the same as it was orginally. I would want to clean the pads off as much as possible and then use sticky flux with the new BGA. But on the other hand, Aim solder has an article about smal
Electronics Forum | Fri Dec 16 18:37:10 EST 2005 | mdemos1
Hi. I am trying to understand Tg and how it relates to reflow. With the higher temperatures of lead free, we have been looking toward laminates with a Tg of 180 instead of the current 140. My question is a little more general. In either lead free
Electronics Forum | Mon Jan 16 04:29:33 EST 2006 | Rob
No, but Kemet were late in adopting lead free finishes in comparison to the Japanese manufacturers, some of which have been compliant for years. The finish on Kemet Chip Caps is generally Matte Tin, & I have checked with our parent company that sell
