Electronics Forum | Wed Aug 01 11:03:20 EDT 2001 | Chip Gill
I read your request for design information on panel layout for V-scoring, and felt the need to respond. Scored PWB's are indeed more efficient to produce and depanel than tab routed PWB's, but there are also drawbacks associated with this method. T
Electronics Forum | Mon Jul 30 11:10:41 EDT 2001 | hinerman
There are several things to look for in a compliant tooling system 1. How much force per pin is required to lock the pins in place? This is especially important since you will be multiplying by the total number of pins on all modules. 2. Is ther
Electronics Forum | Tue Aug 07 01:16:27 EDT 2001 | mugen
When I was reading the smartsonic fantasy, I ended hospitalized for infectious laughs, and side split'in stitches..... Now that cold reality has eased my pain, I must with calm headed purpose, mark my agreement to the Mr.Sean, that salespersons can
Electronics Forum | Tue Jan 25 14:25:47 EST 2000 | Mark Miller
Has any one experienced hand soldering through hole components to white tin plated PCB's using no-clean wire solder? Our facility is presently evaluating white tin vs Sn/Pb coatings. Our only difficulty at this time has been hand soldering of wires
Electronics Forum | Thu Jan 20 12:32:40 EST 2000 | Dave F
Hey Dreamguy: On stand-offs: * "Sugar" stand-offs look nice, after washing (if you wash, as Chad said), but we find them kinda fragile. The only people that can install 'em without bustin' more than they install are the "skill people" that we don
Electronics Forum | Fri Dec 17 03:38:53 EST 1999 | cklau
Hello Guys; I "ll like to add some comment on Mr John message , see below.. "Be sure that the components to be used on the bottom can take the maximum heat of the wave and the delta T of entering the wave."-John The required preheat temp , that i
Electronics Forum | Mon Dec 06 04:48:53 EST 1999 | Charles Stringer
Greg This is one of the eternal questions. I have racked my brains over this one in many organisations. If you are a low volume user (as your run size of 100 to 1000 would indicate) then you are likely to loose more taped components from loading and
Electronics Forum | Mon Dec 06 05:18:53 EST 1999 | Wolfgang Busko
Hi Russ, assuming that only your flux changed and the PCB-finish stayed the same it seems to me that the solderability of that finish is somehow poor. About Ni/Au it can be said that the solderconnection is made between Ni and Sn. The Au-finish is ju
Electronics Forum | Mon Dec 06 17:50:39 EST 1999 | Kantesh Doss
Christopher: Thank you for sharing your experience about the DPAK. Yes, out part has a heat sink at the bottom. Our stencil opening was 7 mils (in both X and Y) smaller than the pad size excepting that the stencil opening consisted of a series of zeb
Electronics Forum | Mon Nov 15 21:35:50 EST 1999 | Dave F
Bob Bob: Fortunately, you found this before you built-up a lot of product. Some thoughs and other drivel: 1 Use IPC-TM-650, Method 2.4.8 for copper peel with a Instron machine. Typical pad peel strength requirement for FR-4, 2 oz. copper is: 6 l
