Electronics Forum: leaded and components and on and hasl and board (Page 1 of 2)

Rohs and non rohs components on a board

Electronics Forum | Mon Feb 12 17:05:29 EST 2007 | Jose

Today is more complicate to find components with lead than with "lead free", and the, I think that you have very feww lead components. And, if don�t work on exceptionals companies, you MUST use LEAD FREE PASTE. In one case, or in the opposite, the re

Rohs and non rohs components on a board

Electronics Forum | Mon Feb 19 15:32:42 EST 2007 | blnorman

We use SnPb paste and bar with leaded and non-leaded component finishes. The predominant finish on components we use is Tin, there are a few NiPdAu. We've had no problems with the component finishes used in the SnPb process.

Rohs and non rohs components on a board

Electronics Forum | Tue Feb 06 21:43:11 EST 2007 | Wayne

If it is instructed to ship lead free product to customer, then low temp lead free solder paste can be considered. For example, Viromet solder paste from Singapore Asahi (peak temp is between 220 to 225 degree C).

Rohs and non rohs components on a board

Electronics Forum | Tue Feb 06 13:16:09 EST 2007 | jaimebc

Leaded paste, is what we use if the process or product requires it.

Rohs and non rohs components on a board

Electronics Forum | Tue Feb 06 06:41:53 EST 2007 | pavel_murtishev

Good afternoon, You have to use lead paste since none-RoHS components won�t withstand elevated temperatures. Solder paste manufacturers offer a lot of transitional pastes designed specially for mixed process. Ask your paste supplier for transitional

Rohs and non rohs components on a board

Electronics Forum | Tue Feb 06 13:24:31 EST 2007 | stepheniii

Good afternoon, > > You have to use lead paste > since none-RoHS components won�t withstand > elevated temperatures. Solder paste manufacturers > offer a lot of transitional pastes designed > specially for mixed process. Ask your paste > suppli

Leaded and Lead Free BGA's on hte same board

Electronics Forum | Thu May 01 15:11:37 EDT 2008 | dphilbrick

CK So as I see it batch B represents a leaded process with leaded components and D is a leaded process with lead free components. Batch Components Paste B SnPb Sn62 D Lead-free Sn62 If so it is BETTER to run a lead free BGA with Sn

Crystalization on TI QFP and other fine pitch components

Electronics Forum | Thu Oct 28 11:50:11 EDT 2010 | phase1

We are having a little trouble with what appears to be a crystalization between our fine pitch parts. The problem appears after a a thourough wash of the pcb when dry. It looks like lead wiskers/haze between the joints.We are using water soluable lea

PB-Free HASL and Leaded Solder

Electronics Forum | Thu May 13 20:40:25 EDT 2021 | winston_one

Yes, we can't use pure Pb PROCESS. And as I say we will not use it anyway, as we have lead-free BGA's, LGAs, component with Solder Charged Terminations... It's became almost normal practice to solder it with leaded solder pastes. In this case peak re

Pb alloy reflow temperatures and component integrity

Electronics Forum | Tue Aug 22 14:59:55 EDT 2000 | Mike Naddra

What does the reflow profile look like , the question I had was surrounding the higher reflow temperature and the max temperature that lowest thermal mass components will see. Some other questions that I had were surrounding the components , what of

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