Electronics Forum | Tue Apr 10 14:35:52 EDT 2007 | UT
We are in middle to prototyping a lead free assembly for one of our customers. We are using lead free bare PCBs, consumables and components, except for two ICs which are leaded per the customer BOM. Will the overall assembly be defined as lead free p
Electronics Forum | Tue Apr 10 17:44:50 EDT 2007 | Anon Y. Mous - Senior SMT Superczar and Process Guy
One of our customers had us building "Pb-free" assemblies with a few Sn/Pb parts on them. THEY got rolling too slowly and we were not able to bring in the required Pb-free components due to lead-time (not Pb-time) issues. When they started requesti
Electronics Forum | Fri Apr 13 04:58:05 EDT 2007 | bartlozie
Hello, we do have very good results with a 'hot air' repair station, and poor results with a 'IR' repair station, but i have to say that the 'IR' station wasn't designed for leadfree use. Make sure you have a good underside heater, adjustable and
Electronics Forum | Wed Apr 18 09:14:17 EDT 2007 | blnorman
For years all our R&D for high temp applications (automotive underhood electronics) has shown that Pb-free, at our max temps, doesn't have the reliability of SnPb. Fortunately, for us, EoLV (End of Life Vehicle) legislation in Europe was enacted bef
Electronics Forum | Sat Apr 21 15:50:14 EDT 2007 | GS
Hi, which kind of stainless steel are made your solder pot components? for istance : AISI-304 ? AISI-306 ? AISI-312 ? AISI-316 ? As we know AISI-316 will last more against Tin erosion. But AM SACX does not allow so much !!! I know who since t
Electronics Forum | Mon May 21 09:06:33 EDT 2007 | davef
Pat: Very descriptive SUBJECT choice. Surface tension: * Soldering and Surface Tension; Champion, JA; Physics Education, V 16, No 2, 1981, pp 98-100(3) Institute of Physics [We have not looked at this, so we cannot comment, but it seems like an appr
Electronics Forum | Tue May 29 05:00:41 EDT 2007 | lococost
Grant, apart from troughput another thing to consider is boarddesign, If there is any SMD within a diameter (eg 3mm) of the connector you won't be able to solder them. I think those are the 2 main disadvantages of selective. That being said, for le
Electronics Forum | Tue Jun 26 21:36:48 EDT 2007 | davef
While your peak temperature measurement is probably correct, you probably ripped the pads from the board long before reaching that temperature. By using a steep temperature ramp, you are causing the corners of the BGA to curl away from the board and
Electronics Forum | Wed Jun 27 11:59:55 EDT 2007 | samir
*Preheat zone *Maximum slope is a time/temperature relationship that measures how fast the temperature on the printed circuit board changes. The ramp�up rate is usually somewhere between 1.0 �C and 3.0 �C per second, often falling between 2.0 �C and
Electronics Forum | Fri Jun 29 09:51:27 EDT 2007 | bjrap3
I have never had a problem with any other BGA's that I reworked. I recently found out that the BGA that we are trying to rework is made poorly and warps automatically from the heat. There is nothing that we could do to prevent this. Also the board
