Electronics Forum | Fri Aug 21 13:58:21 EDT 2009 | ghepo
Dear Mike, because that site and handbooks are property of many hands and because I work in a multinational company as manager of a PCB quality dept. Therefore, be mistaken for a "guru" in this major website, is not my purpose. Anyway, thanks for y
Electronics Forum | Sat Aug 22 09:37:54 EDT 2009 | davef
This gives a different view: http://www.globalsmt.net/regions/mexico/content/view/1184/106/
Electronics Forum | Sat Aug 29 18:12:25 EDT 2009 | gsala
V-Score, few interesting references http://www.vscore.biz/vsguide.html http://coretec-inc.org/files/Technology_Center/Scoring_Process.pdf regards
Electronics Forum | Mon Jan 25 13:42:35 EST 2010 | patrickbruneel
This is a post from another forum as a response from Bob Landman to a claim that he had no evidence to be concerned about lead-free in hirel applications (interesting read). See below and am sure many technetters will find this interesting **********
Electronics Forum | Fri Feb 19 06:09:10 EST 2010 | lococost
feels more like a bit of propaganda. Am I missing something or is leadfree totally irrelevant in the case of Toyota's problems. Surely they are still using leaded solder???
Electronics Forum | Thu Jul 01 00:03:31 EDT 2010 | saukat
Hi.. I am optimizing the reflow oven temperature setting, Interested to know the ideal incoming chiller water temp. My machine is running lead-free process with the incoming chiller water at 12 degree C. Regards,
Electronics Forum | Sun Aug 22 03:00:46 EDT 2010 | horvath83
5 medium sized BGA's are lead process rated only. Lead-free process would most likely destroy them
Electronics Forum | Tue Oct 05 15:20:45 EDT 2010 | scottp
I agree that in consumer electronics there may be nothing wrong with using a lead free BGA in a SnPb process, but that blanket statement can't be made for the high reliability market.
Electronics Forum | Wed Oct 06 12:45:01 EDT 2010 | blnorman
I've seen studies were Pb-free BGAs in a leaded process have no reliability issues when a lead free profile is used. Pb-free profile ensure proper ball collapse and solder joint formation.
Electronics Forum | Thu Oct 07 09:21:30 EDT 2010 | patrickbruneel
Interesting article http://www.usaasc.info/alt_online/article.cfm?iID=1009&aid=09
