Electronics Forum | Mon Sep 17 14:45:57 EDT 2012 | kkay
We are experiencing voiding on one of our lead-free assemblies on every part. The voiding only occurs underneath the parts and not in the solder fillet (see pic). We have tried baking, curing, washing, multiple pastes and everything else we can think
Electronics Forum | Thu Oct 11 07:06:43 EDT 2012 | davef
Remember when the whole 'lead-free' thing first hit us in the stomach? Companies were selling swabs that could detect the presence of lead, which we purchased in hopes of determining if the solderability protection on components was not leaded. I d
Electronics Forum | Wed Dec 05 23:34:32 EST 2012 | aqueous
Typical conveyor speeds on leaded alloys and OA flux is 2 FPM. Typical conveyor speeds on lead-free alloys and OS flux is 0.5 FPM. Temperature should be 140 F. Most polypropylene inlines cleaners should not exceed 140 F. -Mike Konrad Aqueous Technol
Electronics Forum | Fri Jan 24 15:46:29 EST 2014 | davef
Graping is caused by a lack of flux when the oven reflows the paste. Read [“Best Practices Reflow Profiling for Lead-Free SMT Assembly” Ed Briggs and Ronald C. Lasky, Ph.D., PE, Indium Corp] http://www.smtnet.com/library/index.cfm?fuseaction=view_ar
Electronics Forum | Wed May 07 08:16:58 EDT 2014 | emeto
It really depends on pad design and other component on the PCB. Most of the time I run 0201s I have microBGAs on the board and usually print 3mil. Reduction will depend on the paste. For leaded paste you will have reduction (about 10% or so).For Lea
Electronics Forum | Wed Jan 21 12:25:45 EST 2015 | dyoungquist
Kester makes a thermocouple solder: Alloy SN10PB88AG2 Flux "44" Core 58 Diam 0.031" I have used this to solder thermocouples to pcbs when profiling for lead-free temperatures. When done you can unsolder the thermocouple and reuse it again. This g
Electronics Forum | Thu Jan 29 09:29:42 EST 2015 | rgduval
In general, it depends on what you're working on. Boards with a higher thermal profile might require higher temps. But...the usual answer is...set your irons to the lowest temperature possible that still achieves the goal. We usually keep our ir
Electronics Forum | Fri Jan 30 06:14:01 EST 2015 | philc
And there is always the argument of "get in and out quick", which is possible with high tip temps. I prefer to use a really hot iron, and do it quickly, rather than a lower temps and keep the tipi on the bit till it melts the solder. If you have a P
Electronics Forum | Tue May 19 13:29:33 EDT 2015 | dyoungquist
We have been running a Heller 1707EXL for 8 years and added a Heller 1707MKIII about 1 years ago. We have not had any problems with either one of them. We do both lead and lead-free assemblies along with BGA/LGA components. If speed/volume is not
Electronics Forum | Thu Jan 07 10:19:43 EST 2016 | dyoungquist
In 2014 we paid about $40K USD for a new Heller 1707 MKIII (no nitrogen) which is a 7 zone oven. One does not need a 8-10 zone oven unless you are doing high volume. We use the 1707 for everything including lead or lead-free solder, 0.031" to 0.093
