Electronics Forum | Thu Jul 11 06:56:30 EDT 2002 | davef
We have had failure due to a leakage in one ceramic chip capacitor. External inspection did not show any obvious damage. Cross section showed a void in the capacitor. The void was an elliptical shape and positioned longitudinal to the length of the c
Electronics Forum | Wed Jul 10 04:53:47 EDT 2002 | redmary
a leakage exists in the capacitor net (1206), which cause the voltage down so much. the process flow is: printing-placement-reflow-hand load-wave-depanel-FT. I find possible stress maybe exists in the depanel stage, does the extra stress cause the ca
Electronics Forum | Wed Jul 10 22:32:46 EDT 2002 | redmary
i just find the gap inside the component from the cross-section, it indeed exists the interal crack, not solder joint crack. but why the failed capacitor is well after some time. and the other suspicion is the quality of the component.
Electronics Forum | Wed Jul 10 18:19:42 EDT 2002 | davef
Flex cracking under the terminations is generally regarded as one of the primary causes of failure of ceramic chips. If you can see cracks in the solder joints from board flex, those chips are certainly strongly suspect, and you must assume there is
Electronics Forum | Tue Jul 20 08:12:13 EDT 1999 | jacqueline coia
Could someone please tell me if it is possible that erroneous 'leakage current' readings in an instrument could be inheritated by the type, design and fabrication of the PCB itself, if so then where could I find information relating to this subject.