Electronics Forum | Tue Sep 28 10:29:28 EDT 1999 | Wolfgang Busko
| Dear all, | | We've got a curious problem. We have had a major problem with BGA's occasionally being placed one to several rows or columns off the pads. We are using Universal's GSM2 platform for our general purpose placements. Our Universal re
Electronics Forum | Tue Sep 28 05:28:46 EDT 1999 | Wolfgang Busko
| | | I'm trying to start a small SMT contract shop and I need | | | assistance in selecting equipment. Quad seems to be the | | | leader but if there is something else out there that can | | | better suit me please let me know. My shop starting out
Electronics Forum | Tue Sep 28 09:07:02 EDT 1999 | Scott Cook
| | | I'm trying to start a small SMT contract shop and I need | | | assistance in selecting equipment. Quad seems to be the | | | leader but if there is something else out there that can | | | better suit me please let me know. My shop starting out
Electronics Forum | Fri Sep 17 23:59:40 EDT 1999 | JAX
| | | HI everyone, | | | | | | We are using a Siemens ap-25 screen printer, in the past we have not had any problems with adhesive placement until a couple of weeks ago. It seems the x axis has decided that it should be set somewhere between .00
Electronics Forum | Thu Sep 09 15:40:21 EDT 1999 | Scott S. Snider
| Currently, I have been requested to measure our SMT productity, capacity levels. I employed "pcs/day" as a base to come out with | indicators for the top management decision-making. Anyone has | other ideas to measure these two items? | | What
Electronics Forum | Fri Sep 10 13:25:37 EDT 1999 | Earl Moon
| Currently, I have been requested to measure our SMT productity, capacity levels. I employed "pcs/day" as a base to come out with | indicators for the top management decision-making. Anyone has | other ideas to measure these two items? | | What
Electronics Forum | Wed Sep 08 21:32:46 EDT 1999 | Jason Nipper
| | | | | | Hello: | | | | | | We are using a Heller 1500S reflow oven to solder surface mount parts. Just within the last two weeks, the larger I.C.'s are moving while going through the oven. The parts are checked for placement before putting
Electronics Forum | Sun Sep 12 10:51:04 EDT 1999 | K.T
| | | | | | | Hello: | | | | | | | We are using a Heller 1500S reflow oven to solder surface mount parts. Just within the last two weeks, the larger I.C.'s are moving while going through the oven. The parts are checked for placement before put
Electronics Forum | Mon Aug 16 07:54:05 EDT 1999 | Peter Barton
| | | | One of the DFM suggestions I've seen is to remove the solder mask web, i.e. the mask between pads on 20-mil QFP devices. The rational is that if the mask is thicker than the pad the mask can prevent the stencil from making intimate contact w
Electronics Forum | Wed Aug 18 21:03:41 EDT 1999 | Dave F
| | | | | One of the DFM suggestions I've seen is to remove the solder mask web, i.e. the mask between pads on 20-mil QFP devices. The rational is that if the mask is thicker than the pad the mask can prevent the stencil from making intimate contact
