Electronics Forum: level (Page 66 of 232)

BGA storage

Electronics Forum | Wed Jan 19 05:22:20 EST 2000 | Neil Stoddart

Help! I need to know what is the most cost effective and reliable method of storing BGA's at trackside, once they have been removed from their dry pack? The method of storage needs to keep the components below 20% RH, at room temperature without the

Re: Nitrogen to use or not to use

Electronics Forum | Tue Dec 21 08:33:54 EST 1999 | Nancy V

Luis, Go to the library on SMTnet and you will see Standard and Terms. Select that and you will be able to download the terms and definitions for SMT assembly. It is very useful. Of the terms you requested, only FPY is not there. I was curious a

Re: i wonder crack of the tsop

Electronics Forum | Fri Oct 29 04:51:11 EDT 1999 | Wolfgang Busko

Hi Eom, no matter what size the crack is it�s a no-no and you should take any precaution to avoid this cracking. Ask your vendor if you are not sure which moisture level applies for your part. Follow the recommended handling specifications for moistu

0.003 track PCB's

Electronics Forum | Fri Oct 15 03:54:38 EDT 1999 | Gregor McInnes

Does anybody Know of a U.K. vendor who can supply Multilayer boards of up to 14+ layers at track and gap sizes of 0.003"? Even European vendors would be good. Curently we have to go to the states for this level of board and it is throwing our commit

PCB warpage

Electronics Forum | Thu Oct 14 04:28:29 EDT 1999 | Grace Chua

Hi there, I have quite a number of problematic bd due to warpage problem. I would like to know the method on how to measure PCB warpage, thus to decide on the dispositon of these boards. Another question, can these warp bd be rework/fix. Is there

Re: HELP!! via sizes, location

Electronics Forum | Wed Oct 06 04:23:09 EDT 1999 | Brian

| | I am a new employee at a company that has had a large turnover of employees over the past year. I am working on a board (components on one side only), the engineer (he is also new ) wants to use an .035 pad with a .021 dia. hole, there are no via

SMT productivity measurement

Electronics Forum | Thu Sep 09 00:57:42 EDT 1999 | Stoney Tsai

Currently, I have been requested to measure our SMT productity, capacity levels. I employed "pcs/day" as a base to come out with indicators for the top management decision-making. Anyone has other ideas to measure these two items? What are the lat

Re: SMT productivity measurement

Electronics Forum | Thu Sep 09 08:58:07 EDT 1999 | Dave F

| Currently, I have been requested to measure our SMT productity, capacity levels. I employed "pcs/day" as a base to come out with | indicators for the top management decision-making. Anyone has | other ideas to measure these two items? | | What

Heat Dissipation Problem

Electronics Forum | Wed Sep 01 12:26:32 EDT 1999 | Jae Hinson

To aid in heat dissipation of our PCB, we would like to try having copper fill areas on the board that are hot air levelled and not covered with solder resist. Then, when the board is reflowed, solder paste would be applied and then solder. Has anyon

Classification of moisture sensitive devices

Electronics Forum | Thu Aug 26 03:59:46 EDT 1999 | Wolfgang Busko

Having implemented the process of handling moisture sensitive devices our logistics department tries to classify all parts according to their moisture level. Going through datasheets wasn�t that helpfull, so does anyone know of a source for that spe


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